公开(公告)号：US20190194496A1

公开(公告)日：2019-06-27

申请号：US16329394

申请日：2017-06-29

Applicant: IPI TECH INC.

Inventor： Kye-Ung LEE ,  Ho-Young PARK ,  Tae-Seok LEE

IPC: C09J7/29 ,  H01L23/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28

CPC classification number: C09J7/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  C09J2203/326 ,  C09J2479/086 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/488 ,  H01L23/498 ,  H01L24/50 ,  H01L2924/07025

Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.