公开(公告)号：US20230412968A1

公开(公告)日：2023-12-21

申请号：US18334489

申请日：2023-06-14

Applicant: Infineon Technologies AG

Inventor： Christian Bretthauer ,  Marco Haubold ,  Bjoern Oliver Eversmann ,  Dominik Mayrhofer

IPC: H04R1/24 ,  H04R3/14 ,  H04R17/00 ,  H04R3/04 ,  H04R23/00 ,  H04R23/02 ,  H04R1/02 ,  H04R7/04

CPC classification number: H04R1/24 ,  H04R3/14 ,  H04R17/00 ,  H04R3/04 ,  H04R23/002 ,  H04R23/02 ,  H04R1/025 ,  H04R7/04 ,  H04R2201/003

Abstract: A MEMS package comprises a first speaker arrangement configured for emitting sound in a first audio frequency range and a second speaker arrangement configured for emitting sound in a different second audio frequency range.