SUBSTRATE PROCESSING CHAMBER AND PROCESS GAS FLOW DEFLECTOR FOR USE IN THE PROCESSING CHAMBER

    公开(公告)号:US20220018023A1

    公开(公告)日:2022-01-20

    申请号:US17370386

    申请日:2021-07-08

    Abstract: A processing chamber includes a chamber body, a substrate support configured to hold a substrate in place, and a pre-heat ring having a central opening sized to be disposed around the substrate. A process gas inlet is configured to direct process gas in a lateral direction to flow over the pre-heat ring and the substrate. A process gas flow deflector includes a radially outer mounting portion and a radially inner blade-shaped process gas deflection portion extending in a radial direction. The radially inner blade-shaped process gas deflection portion is shaped as a ring segment. The radially inner blade-shaped process gas deflection portion is disposed above the process gas inlet and dimensioned to overlap with the pre-heat ring, wherein a degree of overlap between the pre-heat ring and process gas flow deflector in the radial direction is at least ½ of the radial dimension of the pre-heat ring.

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