公开(公告)号：US20180350780A1

公开(公告)日：2018-12-06

申请号：US16047688

申请日：2018-07-27

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Holger Doepke ,  Olaf Hohlfeld ,  Michael Juerss

IPC: H01L25/07

CPC classification number: H01L25/072 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/03462 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48491 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1377 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric layer.

公开(公告)号：US10600690B2

公开(公告)日：2020-03-24

申请号：US16102174

申请日：2018-08-13

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: B32B37/26 ,  B32B38/10 ,  H01L21/78 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00 ,  B32B7/027 ,  H05K3/00 ,  B32B7/06

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

公开(公告)号：US10043782B2

公开(公告)日：2018-08-07

申请号：US15470960

申请日：2017-03-28

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Holger Doepke ,  Olaf Hohlfeld ,  Michael Juerss

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/28 ,  H01L25/07 ,  H01L21/52 ,  H01L23/29 ,  H01L23/552 ,  H01L23/00

Abstract: A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.

公开(公告)号：US20180350683A1

公开(公告)日：2018-12-06

申请号：US16102174

申请日：2018-08-13

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/56 ,  B32B37/26

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

公开(公告)号：US20160247739A1

公开(公告)日：2016-08-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/26 ,  H01L23/3135 ,  H01L23/564 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3025

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Abstract translation: 粘合系统包括包括吸湿材料的重构晶片。 防潮层设置在重构晶片的表面上。 粘合剂层布置在与重构的晶片相对的防潮层的表面上。 载体布置在与防潮层相对的粘合剂层的表面上。 粘合剂层将重构的晶片和载体粘合地结合在一起。

公开(公告)号：US20160218039A1

公开(公告)日：2016-07-28

申请号：US15002009

申请日：2016-01-20

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: H01L21/78 ,  H05K3/00 ,  H01L21/683

CPC classification number: H01L21/78 ,  B32B37/26 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/562 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H05K3/007 ,  Y10S156/93 ,  Y10S156/941

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Abstract translation: 一种用于处理产品基板的方法包括将载体接合到产品基板。 将一层永久性粘合剂施加到载体的表面上。 提供了结构化的中间层。 施加的永久性粘合剂将载体粘合到产品基材上。 结构化中间层布置在产品基板和载体之间。 结构化中间层的表面和永久性粘合剂的表面直接接触产品基材的表面。 结构化中间层降低了产品基板和载体之间的结合强度。

公开(公告)号：US11804432B2

公开(公告)日：2023-10-31

申请号：US17173863

申请日：2021-02-11

Applicant: Infineon Technologies AG

Inventor： Markus Zundel ,  Sergey Ananiev ,  Andreas Behrendt ,  Holger Doepke ,  Uwe Schmalzbauer ,  Michael Sorger ,  Dominic Thurmer

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/528 ,  H01L21/76825 ,  H01L21/76837 ,  H01L23/5329 ,  H01L2924/00 ,  H01L2924/0002

Abstract: A semiconductor device includes a semiconductor substrate having a first main surface and a metal structure above the first main surface. The metal structure has a periphery region that includes a transition section along which the metal structure transitions from a first thickness to a second thickness less than the first thickness. A polymer-based insulating material contacts and covers at least the periphery region of the metal structure. A thickness of the polymer-based insulating material begins to increase on a first main surface of the metal structure that faces away from the semiconductor substrate and continues to increase in a direction towards the transition section. An average slope of a surface of the polymer-based insulating material which faces away from the semiconductor substrate, as measured with respect to the first main surface of the metal structure, is less than 60 degrees along the periphery region of the metal structure.

公开(公告)号：US20220254713A1

公开(公告)日：2022-08-11

申请号：US17173863

申请日：2021-02-11

Applicant: Infineon Technologies AG

Inventor： Markus Zundel ,  Sergey Ananiev ,  Andreas Behrendt ,  Holger Doepke ,  Uwe Schmalzbauer ,  Michael Sorger ,  Dominic Thurmer

IPC: H01L23/528 ,  H01L23/532 ,  H01L21/768

Abstract: A semiconductor device includes a semiconductor substrate having a first main surface and a metal structure above the first main surface. The metal structure has a periphery region that includes a transition section along which the metal structure transitions from a first thickness to a second thickness less than the first thickness. A polymer-based insulating material contacts and covers at least the periphery region of the metal structure. A thickness of the polymer-based insulating material begins to increase on a first main surface of the metal structure that faces away from the semiconductor substrate and continues to increase in a direction towards the transition section. An average slope of a surface of the polymer-based insulating material which faces away from the semiconductor substrate, as measured with respect to the first main surface of the metal structure, is less than 60 degrees along the periphery region of the metal structure.

公开(公告)号：US10332814B2

公开(公告)日：2019-06-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L23/31

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

公开(公告)号：US10056295B2

公开(公告)日：2018-08-21

申请号：US15002009

申请日：2016-01-20

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Claus von Waechter ,  Michael Bauer ,  Holger Doepke ,  Dominic Maier ,  Daniel Porwol ,  Tobias Schmidt

IPC: H01L21/78 ,  H01L21/683 ,  B32B37/26 ,  H01L21/56 ,  H01L23/00 ,  H05K3/00

CPC classification number: H01L21/78 ,  B32B37/26 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/562 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H05K3/007 ,  Y10S156/93 ,  Y10S156/941

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.