公开(公告)号：US20250130294A1

公开(公告)日：2025-04-24

申请号：US18916926

申请日：2024-10-16

Applicant: Infineon Technologies AG

Inventor： Horst THEUSS

IPC: G01R33/00 ,  G01R33/09

Abstract: A sensor device contains a magnetic field sensor chip. The magnetic field sensor chip contains a semiconductor substrate having a first surface and a second surface opposite the first surface, a sensor element that is arranged at the first surface and is configured to detect a magnetic field present at the location of the sensor element, and at least one trench extending from at least one of the two surfaces into the semiconductor substrate. The sensor element is spaced laterally from the at least one trench.

公开(公告)号：US20230315235A1

公开(公告)日：2023-10-05

申请号：US18188611

申请日：2023-03-23

Applicant: Infineon Technologies AG

Inventor： Klaus ELIAN ,  Matthias EBERL ,  Horst THEUSS ,  Rainer Markus SCHALLER ,  Fabian MERBELER

IPC: G06F3/043

CPC classification number: G06F3/043 ,  G06F2203/04103

Abstract: An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

公开(公告)号：US20200341023A1

公开(公告)日：2020-10-29

申请号：US16841870

申请日：2020-04-07

Applicant: Infineon Technologies AG

Inventor： Manfred SCHINDLER ,  Horst THEUSS ,  Michael WEBER

IPC: G01P3/44 ,  H01L25/16 ,  H01L23/62 ,  H01L49/02 ,  H01L23/31 ,  G01D5/14 ,  G01D5/16

Abstract: A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.

公开(公告)号：US20190221533A1

公开(公告)日：2019-07-18

申请号：US16246912

申请日：2019-01-14

Applicant: Infineon Technologies AG

Inventor： Horst THEUSS ,  Rudolf BERGER ,  Walter HARTNER ,  Veronika HUBER ,  Werner ROBL

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/05 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03848 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip, an electrical connection element for electrically connecting the semiconductor device to a carrier, and a metallization adjoining the electrical connection element, the metallization contains porous nanocrystalline copper that contains portions of organic acids.

公开(公告)号：US20150307344A1

公开(公告)日：2015-10-29

申请号：US14693902

申请日：2015-04-23

Applicant: Infineon Technologies AG

Inventor： Georg ERNST ,  Horst THEUSS

IPC: B81B7/00 ,  G01L1/16 ,  G01L1/14 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/098 ,  B81C1/00301 ,  G01L1/148 ,  G01L1/16 ,  G01L19/0069 ,  G01L19/0084 ,  H01L23/49838 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract translation: 在各种实施例中，提供了传感器装置。 传感器装置包括具有多个电触点的传感器装置; 壳体，具有多个侧壁; 以及金属载体结构，其以从多个侧壁穿过两个彼此相对的侧壁的方式延伸到壳体中。 金属载体结构至少在金属载体结构延伸的侧壁的方向上以弹性方式实施。 具有多个电触头的传感器装置以弹性方式安装在金属载体结构上，并且通过多个触点与导电连接到金属载体结构。

公开(公告)号：US20230010130A1

公开(公告)日：2023-01-12

申请号：US17850026

申请日：2022-06-27

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Jochen DANGELMAIER ,  Klaus ELIAN ,  Horst THEUSS

IPC: G06F3/043

Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.

公开(公告)号：US20220373784A1

公开(公告)日：2022-11-24

申请号：US17659749

申请日：2022-04-19

Applicant: Infineon Technologies AG

Inventor： Horst THEUSS ,  Klaus ELIAN ,  Cyrus GHAHREMANI

IPC: G02B26/08 ,  G02B26/10 ,  G02B7/182 ,  G02B27/14

Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.

公开(公告)号：US20220247089A1

公开(公告)日：2022-08-04

申请号：US17648730

申请日：2022-01-24

Applicant: Infineon Technologies AG

Inventor： Walter HARTNER ,  Tuncay ERDOEL ,  Klaus ELIAN ,  Christian GEISSLER ,  Bernhard RIEDER ,  Rainer Markus SCHALLER ,  Horst THEUSS ,  Maciej WOJNOWSKI

IPC: H01Q21/00 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/16

Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

公开(公告)号：US20220009438A1

公开(公告)日：2022-01-13

申请号：US17351329

申请日：2021-06-18

Applicant: Infineon Technologies AG

Inventor： Rainer Markus SCHALLER ,  Horst THEUSS

IPC: B60R21/0136 ,  B81B3/00

Abstract: A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.

公开(公告)号：US20190293923A1

公开(公告)日：2019-09-26

申请号：US15959628

申请日：2018-04-23

Applicant: Infineon Technologies AG

Inventor： Cyrus GHAHREMANI ,  Horst THEUSS

IPC: G02B26/08 ,  B81B7/00 ,  B81C1/00 ,  G02B27/00 ,  G02B26/10 ,  G01S7/481 ,  G01S7/486

Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.