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公开(公告)号：US20200068709A1
公开(公告)日：2020-02-27
申请号：US16550151
申请日：2019-08-23
Applicant: Infineon Technologies AG
Inventor： Hans-Joachim SCHULZE , Andre BROCKMEIER , Tobias Franz Wolfgang HOECHBAUER , Gerhard METZGER-BRUECKL , Matteo PICCIN , Francisco Javier SANTOS RODRIGUEZ
IPC: H05K1/03 , H01L29/16 , H01L21/683
Abstract: A carrier configured to be attached to a semiconductor substrate via a first surface comprises a continuous carbon structure defining a first surface of the carrier, and a reinforcing material constituting at least 2 vol-% of the carrier.
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