公开(公告)号：US09997476B2

公开(公告)日：2018-06-12

申请号：US14928812

申请日：2015-10-30

Applicant: Infineon Technologies AG

Inventor： Xikun Zhang ,  Dejiang Chang ,  Bill Agar ,  Michael Lefevre ,  Alexander Komposch

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/495 ,  H01L25/07 ,  H01L29/16 ,  H01L25/00

CPC classification number: H01L23/66 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L29/16 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/83136 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13091 ,  H01L2924/19041

Abstract: A multi-die package is manufactured by attaching a first semiconductor die made of a first semiconductor material to a thermally conductive flange via a first die attach material, and attaching a second semiconductor die to the same thermally conductive flange as the first semiconductor die via a second die attach material. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. The first semiconductor die is held in place by the first die attach material during attachment of the second semiconductor die to the flange. Leads are attached to the thermally conductive flange or to an insulating member secured to the flange. The leads provide external electrical access to the first and second semiconductor dies.

公开(公告)号：US20170125362A1

公开(公告)日：2017-05-04

申请号：US14928812

申请日：2015-10-30

Applicant: Infineon Technologies AG

Inventor： Xikun Zhang ,  Dejiang Chang ,  Bill Agar ,  Michael Lefevre ,  Alexander Komposch

IPC: H01L23/66 ,  H01L23/498 ,  H01L25/00 ,  H01L29/16 ,  H01L23/00 ,  H01L23/495 ,  H01L25/07

CPC classification number: H01L23/66 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L29/16 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/83136 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13091 ,  H01L2924/19041

Abstract: A multi-die package is manufactured by attaching a first semiconductor die made of a first semiconductor material to a thermally conductive flange via a first die attach material, and attaching a second semiconductor die to the same thermally conductive flange as the first semiconductor die via a second die attach material. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. The first semiconductor die is held in place by the first die attach material during attachment of the second semiconductor die to the flange. Leads are attached to the thermally conductive flange or to an insulating member secured to the flange. The leads provide external electrical access to the first and second semiconductor dies.

公开(公告)号：US20180254253A1

公开(公告)日：2018-09-06

申请号：US15973276

申请日：2018-05-07

Applicant: Infineon Technologies AG

Inventor： Xikun Zhang ,  Dejiang Chang ,  Bill Agar ,  Michael Lefevre ,  Alexander Komposch

IPC: H01L23/66 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L29/16

CPC classification number: H01L23/66 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L25/50 ,  H01L29/16 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/83136 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13091 ,  H01L2924/19041

Abstract: A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.