公开(公告)号：US20200043883A1

公开(公告)日：2020-02-06

申请号：US16527289

申请日：2019-07-31

Applicant: Infineon Technologies AG

Inventor： Florian Eacock ,  Michal Chajneta ,  Stefan Tophinke

IPC: H01L23/00 ,  G05B19/18

Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.

公开(公告)号：US20220347786A1

公开(公告)日：2022-11-03

申请号：US17245182

申请日：2021-04-30

Applicant: Infineon Technologies AG

Inventor： Till Neddermann ,  Michal Chajneta ,  Alparslan Takkac

IPC: B23K20/10

Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

公开(公告)号：US20230390859A1

公开(公告)日：2023-12-07

申请号：US18235428

申请日：2023-08-18

Applicant: Infineon Technologies AG

Inventor： Till Neddermann ,  Michal Chajneta ,  Alparslan Takkac

IPC: B23K20/10

CPC classification number: B23K20/106 ,  B23K2103/12

Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

公开(公告)号：US11772187B2

公开(公告)日：2023-10-03

申请号：US17245182

申请日：2021-04-30

Applicant: Infineon Technologies AG

Inventor： Till Neddermann ,  Michal Chajneta ,  Alparslan Takkac

IPC: B23K20/00 ,  B23K20/10 ,  B23K103/12 ,  B23K101/36

CPC classification number: B23K20/106 ,  B23K2101/36 ,  B23K2103/12

Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

公开(公告)号：US12109645B2

公开(公告)日：2024-10-08

申请号：US18235428

申请日：2023-08-18

Applicant: Infineon Technologies AG

Inventor： Till Neddermann ,  Michal Chajneta ,  Alparslan Takkac

IPC: B23K20/00 ,  B23K20/10 ,  B23K101/36 ,  B23K103/12

CPC classification number: B23K20/106 ,  B23K2101/36 ,  B23K2103/12

Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

公开(公告)号：US20240332136A1

公开(公告)日：2024-10-03

申请号：US18609133

申请日：2024-03-19

Applicant: Infineon Technologies AG

Inventor： Marco Bäßler ,  Michal Chajneta ,  Thorsten Scharf ,  Egbert Lamminger

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L23/49548 ,  H01L23/49575

Abstract: A power semiconductor device includes: at least one substrate; at least one power semiconductor die arranged over the at least one substrate; a first leadframe arranged over the at least one power semiconductor substrate and over the at least one power semiconductor die, the first leadframe being arranged at least partially in a first plane and including one or more connecting portions extending out of the first plane in a first direction; and a second leadframe at least partially arranged in a second plane above or below the first plane and including one or more attachment sites. The one or more connecting portions extend into the second plane at the one or more attachment sites. The one or more connecting portions are arranged at a non-zero distance from the second leadframe, the non-zero distance being bridged by weld seams at the one or more attachment sites.

公开(公告)号：US11646291B2

公开(公告)日：2023-05-09

申请号：US16527289

申请日：2019-07-31

Applicant: Infineon Technologies AG

Inventor： Florian Eacock ,  Michal Chajneta ,  Stefan Tophinke

IPC: H01L23/00 ,  G05B19/18

CPC classification number: H01L24/78 ,  G05B19/182 ,  G05B2219/37008 ,  G05B2219/45033 ,  H01L2224/78001 ,  H01L2224/78343

Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping. The second bonding machine is adapted to modify a second control signal based on a first electrical parameter of the first electrical calibration supply and on a second electrical parameter of the second electrical calibration supply in order to generate a modified second control signal, provide the modified second control signal to the power supply in order to cause the second power supply to generate a second electrical supply, and provide the second electrical supply to the second ultrasonic transducer.