公开(公告)号：US20230164911A1

公开(公告)日：2023-05-25

申请号：US17989228

申请日：2022-11-17

Applicant: Infineon Technologies AG

Inventor： Mahadi-Ul HASSAN ,  Petteri PALM ,  Thomas GEBHARD

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/0259 ,  H05K3/4655 ,  H05K1/185 ,  H05K2201/10166

Abstract: A printed circuit board and method of manufacturing a printed circuit board are disclosed. In one example, the method comprises embedding an electronic component in a laminate, and protecting the electronic component against electrostatic discharge during at least part of the manufacturing process by an electrically conductive electrostatic discharge protection structure integrated in the laminate and connected to the electronic component.

公开(公告)号：US20250105129A1

公开(公告)日：2025-03-27

申请号：US18806998

申请日：2024-08-16

Applicant: Infineon Technologies AG

Inventor： Urban MEDIC ,  Christian Stefan RAINER ,  Thomas GEBHARD ,  Eslam Mohammed ABDELHAMID

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L25/065

Abstract: An electronic device is disclosed. In one example, the electronic device comprises a laminate carrier comprising a plurality of laminated layers, an electronic component embedded in the laminate carrier, and an at least partially electrically conductive pin extending partially inside the laminate carrier and partially protruding beyond the laminate carrier. The pin is electrically coupled with the electronic component.