公开(公告)号：US10123429B2

公开(公告)日：2018-11-06

申请号：US15215412

申请日：2016-07-20

Applicant: Infineon Technologies AG

Inventor： Philip Georg Brockerhoff ,  Tilo Weide

IPC: H05K7/10 ,  H05K7/12 ,  H05K3/30 ,  H05K1/18 ,  H05K3/32

Abstract: A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.

公开(公告)号：US20180027655A1

公开(公告)日：2018-01-25

申请号：US15215412

申请日：2016-07-20

Applicant: Infineon Technologies AG

Inventor： Philip Georg Brockerhoff ,  Tilo Weide

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/182 ,  H05K3/325 ,  H05K2201/09709 ,  H05K2201/10545 ,  H05K2201/1059

Abstract: A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.