公开(公告)号：US20170194288A1

公开(公告)日：2017-07-06

申请号：US14986727

申请日：2016-01-04

Applicant: Infineon Technologies AG

Inventor： Peter OSSIMITZ ,  Tobias JACOBS

IPC: H01L25/065 ,  H01L23/528 ,  H01L21/768 ,  H01L23/532 ,  H01L21/66 ,  H01L25/00 ,  H01L23/522 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L21/76877 ,  H01L22/32 ,  H01L23/3171 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53219 ,  H01L23/53228 ,  H01L24/04 ,  H01L25/50 ,  H01L2225/06513

Abstract: Representative implementations of devices and techniques provide optimized electrical performance of interconnectivity components of multi-layer integrated circuits (IC) such as chip dice, for example. Different layers of the multi-layer IC include contact terminals that may be used to connect to circuits, systems, and carriers external to the IC.