公开(公告)号：US20230288695A1

公开(公告)日：2023-09-14

申请号：US17690158

申请日：2022-03-09

Applicant: Infineon Technologies AG

Inventor： Andre BROCKMEIER ,  Ulf BARTL ,  Kurt SORSCHAG

IPC: G02B26/08 ,  B81B7/00 ,  B81C1/00

CPC classification number: G02B26/085 ,  B81B7/0038 ,  B81B7/0067 ,  B81C1/00285 ,  B81C1/00317 ,  B81B2201/042 ,  B81C2203/0118

Abstract: A microelectromechanical systems (MEMS) mirror package assembly includes: a MEMS wafer including a stator portion and a rotor portion that includes a MEMS mirror configured to rotate about an axis, wherein the MEMS mirror is suspended over a back cavity, wherein the MEMS wafer defines a first portion of the back cavity; a spacer wafer, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; a transparent cover wafer, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer includes a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity. The center of the MEMS mirror is arranged substantially at a vertex of the transparent dome structure.