公开(公告)号：US20250079412A1

公开(公告)日：2025-03-06

申请号：US18954408

申请日：2024-11-20

Applicant: Innolux Corporation

Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

Abstract: An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.

公开(公告)号：US20240321844A1

公开(公告)日：2024-09-26

申请号：US18679375

申请日：2024-05-30

Applicant: Innolux Corporation

Inventor： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

IPC: H01L25/13 ,  H01L33/56

CPC classification number: H01L25/13 ,  H01L33/56 ,  H01L2933/005

Abstract: An electronic device including a first substrate body, a plurality of light-emitting diodes, a second substrate body, a first polymer element, and a second polymer element is provided. The first substrate body has a light-emitting region and a non-light-emitting region adjacent to the light-emitting region. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate body is disposed opposite to the first substrate body. The first polymer element is disposed between the plurality of light-emitting diodes and the second substrate body, and disposed in the light-emitting region. The second polymer element is disposed between the first substrate body and the second substrate body, and disposed in the non-light-emitting region. There is a distance between a top surface of the second polymer element and a bottom surface of the second substrate body, and the distance is greater than 0.

公开(公告)号：US12027506B2

公开(公告)日：2024-07-02

申请号：US18149661

申请日：2023-01-03

Applicant: Innolux Corporation

Inventor： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

IPC: H01L33/56 ,  H01L25/13

CPC classification number: H01L25/13 ,  H01L33/56 ,  H01L2933/005

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.

公开(公告)号：US11955579B2

公开(公告)日：2024-04-09

申请号：US17725741

申请日：2022-04-21

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L33/0093 ,  H01L33/0095 ,  H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0075 ,  H01L33/32 ,  H01L2933/0066

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

公开(公告)号：US11658262B1

公开(公告)日：2023-05-23

申请号：US16853723

申请日：2020-04-20

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device is provided. The method for manufacturing the light emitting device includes: providing a substrate with light emitting units disposed thereon; attaching the light emitting units to a carrier; removing the substrate; and transferring a portion of the light emitting units from the carrier to a driving substrate.

公开(公告)号：US11574897B2

公开(公告)日：2023-02-07

申请号：US17026325

申请日：2020-09-21

Applicant: Innolux Corporation

Inventor： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

IPC: H01L29/18 ,  H01L25/13 ,  H01L33/56

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

公开(公告)号：US11335827B2

公开(公告)日：2022-05-17

申请号：US16858826

申请日：2020-04-27

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

公开(公告)号：US20210111164A1

公开(公告)日：2021-04-15

申请号：US17026325

申请日：2020-09-21

Applicant: Innolux Corporation

Inventor： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

IPC: H01L25/13 ,  H01L33/56

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

公开(公告)号：US12294038B2

公开(公告)日：2025-05-06

申请号：US18298343

申请日：2023-04-10

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

公开(公告)号：US20250062151A1

公开(公告)日：2025-02-20

申请号：US18935636

申请日：2024-11-03

Applicant: InnoLux Corporation

Inventor： Fang-Ying Lin ,  Kai Cheng ,  Ming-Chang Lin ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Shu-Ming Kuo

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.