公开(公告)号：US20220216383A1

公开(公告)日：2022-07-07

申请号：US17543747

申请日：2021-12-07

Applicant: Innolux Corporation

Inventor： Ming-Chang Lin

IPC: H01L33/62 ,  H01L33/00

Abstract: The disclosure provides a light emitting device and a manufacturing method thereof. The light emitting device includes a substrate, a light emitting element, and a bonding structure. The light emitting element is disposed on the substrate through the bonding structure. The bonding structure includes at least three bonding layers and at least two passivation layers, which are in a staggered arrangement. The method for manufacturing the light emitting device includes the following steps: providing a substrate, forming a first bonding layer on the substrate, forming a first passivation layer on the first bonding layer, providing a light emitting element, forming a second bonding layer on the light emitting element, forming a second passivation layer on the second bonding layer. The second passivation layer on the light emitting element is contacted with the first passivation layer to form a third bonding layer and bond the light emitting element on the substrate.

公开(公告)号：US11005074B2

公开(公告)日：2021-05-11

申请号：US16865673

申请日：2020-05-04

Applicant: InnoLux Corporation

Inventor： Shun-Yuan Hu ,  Tsau-Hua Hsieh ,  Tzu-Min Yan ,  Ming-Chang Lin ,  Yu-Hsin Liu ,  Shu-Ming Kuo ,  Ming-I Chao

IPC: H01L33/50 ,  H01L33/64 ,  H01L33/46 ,  H01L33/58 ,  H01L51/52 ,  H01L25/075 ,  H01L33/62 ,  H05B45/00 ,  H01L25/16 ,  H01L33/44 ,  H01L33/54 ,  H01L33/20

Abstract: A display device is provided. The display device includes a light-emitting unit. The light-emitting unit includes a light-emitting part, wherein a light extraction structure is disposed on a first surface of the light-emitting part. The light-emitting unit also includes a connective part disposed on a second surface opposite to the first surface of the light-emitting part. The light-emitting unit further includes a protective part surrounding the light-emitting part and the connective part. In addition, the display device includes a substrate having a plurality of active elements and at least one bonding pad, wherein the bonding pad is electrically connected to the corresponding connective part of the light-emitting unit. The roughness of the light extraction structure is greater than or equal to 0.2 μm and less than or equal to 5 μm.

公开(公告)号：US20230072729A1

公开(公告)日：2023-03-09

申请号：US17985902

申请日：2022-11-13

Applicant: InnoLux Corporation

Inventor： Ming-Chang Lin ,  Tzu-Min Yan

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/16

Abstract: A method of manufacturing an electronic device includes providing a substrate, forming a solder on the substrate, and bonding a diode to the substrate through the solder, wherein the solder is formed by stacking a plurality of first conductive layers and a plurality of second conductive layers alternately, and the plurality of first conductive layers and the plurality of second conductive layers include different materials.

公开(公告)号：US09589994B2

公开(公告)日：2017-03-07

申请号：US14610085

申请日：2015-01-30

Applicant: Innolux Corporation

Inventor： Kuan-Feng Lee ,  Ming-Chang Lin ,  Tzu-Min Yan

IPC: H01L27/12 ,  H01L27/32

CPC classification number: H01L27/3258 ,  G02F1/1368 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3248 ,  H01L27/3262 ,  H01L29/24 ,  H01L29/7869 ,  H01L2251/301 ,  H01L2251/303

Abstract: A display panel whose TFT substrate comprises a substrate, a gate layer, a gate dielectric layer, a semiconductor layer, a first electrode layer, a first passivation layer, a second passivation layer, a via and a second electrode layer is provided. The gate layer is disposed on the substrate. The gate dielectric layer is disposed on the gate layer. The semiconductor layer is disposed on the gate dielectric layer. The first electrode layer is disposed on the semiconductor layer. The first and second passivation layers are sequentially disposed on the first electrode layer. The via penetrates the passivation layers to expose the first electrode layer. The second electrode layer is electrically connected to the first electrode layer through the via. The first and second passivation layers have first and second taper angles respectively. The difference between the first and second taper angles is below 30°.

Abstract translation: 提供了TFT基板包括基板，栅极层，栅极介电层，半导体层，第一电极层，第一钝化层，第二钝化层，通孔和第二电极层的显示面板。 栅极层设置在基板上。 栅极电介质层设置在栅极层上。 半导体层设置在栅介质层上。 第一电极层设置在半导体层上。 第一和第二钝化层依次设置在第一电极层上。 通孔穿透钝化层以露出第一电极层。 第二电极层通过通孔与第一电极层电连接。 第一和第二钝化层分别具有第一和第二锥角。 第一和第二锥角之间的差值低于30°。

公开(公告)号：US09494831B2

公开(公告)日：2016-11-15

申请号：US14307522

申请日：2014-06-18

Applicant: Innolux Corporation

Inventor： Shun-Fu Chiu ,  Ming-Chang Lin ,  Ying-Tong Lin

IPC: H01L27/12 ,  G02F1/1343 ,  G02F1/1362 ,  G02F1/1333

CPC classification number: G02F1/134309 ,  G02F1/133345 ,  G02F1/13439 ,  G02F1/1362 ,  G02F1/136286 ,  H01L27/1214 ,  H01L27/124

Abstract: A display panel comprises a first substrate, a second substrate opposite to the first substrate, and a display medium layer disposed between the first and second substrates. The first substrate comprises a conductive layer formed on the first base plate and extending along a first direction. Along the first direction, the conductive layer comprises a first plane correspondingly at a first height, a tilted plane, and a second plane correspondingly at a second height in sequential order. The first height is greater than the second height. A position of the first plane adjacent to the tilted plane of the conductive layer has a first line width along the second direction. A position of the tilted plane adjacent to the second plane of the conductive layer has a second line width along the second direction. The first line width is shorter than the second line width.

Abstract translation: 显示面板包括第一基板，与第一基板相对的第二基板，以及设置在第一和第二基板之间的显示介质层。 第一基板包括形成在第一基板上并沿着第一方向延伸的导电层。 沿着第一方向，导电层包括相应于第一高度的第一平面，倾斜平面和相应于第二高度的第二平面。 第一个高度大于第二个高度。 与导电层的倾斜平面相邻的第一平面的位置沿第二方向具有第一线宽。 与导电层的第二平面相邻的倾斜平面的位置沿第二方向具有第二线宽。 第一行宽度比第二行宽度短。

公开(公告)号：US20250062151A1

公开(公告)日：2025-02-20

申请号：US18935636

申请日：2024-11-03

Applicant: InnoLux Corporation

Inventor： Fang-Ying Lin ,  Kai Cheng ,  Ming-Chang Lin ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Shu-Ming Kuo

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.

公开(公告)号：US20240233590A9

公开(公告)日：2024-07-11

申请号：US18468752

申请日：2023-09-18

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Fang-Ying Lin ,  Ming-Chang Lin ,  Tsau-Hua Hsieh

IPC: G09G3/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L33/62 ,  G09G2330/12

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N

公开(公告)号：US20240153924A1

公开(公告)日：2024-05-09

申请号：US18376002

申请日：2023-10-03

Applicant: InnoLux Corporation

Inventor： Fang-Ying Lin ,  Kai Cheng ,  Ming-Chang Lin ,  Tsau-Hua Hsieh

IPC: H01L25/075 ,  G09G3/00

CPC classification number: H01L25/0753 ,  G09G3/006 ,  G09G2330/08 ,  G09G2330/12 ,  H01L2933/0066

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.

公开(公告)号：US10546842B2

公开(公告)日：2020-01-28

申请号：US15971291

申请日：2018-05-04

Applicant: InnoLux Corporation

Inventor： Shun-Yuan Hu ,  Chia-Hsiu Hsu ,  Ming-I Chao ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Tsau-Hua Hsieh

IPC: H01L25/075 ,  H01L27/00 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L27/12 ,  H01L33/06 ,  H01L33/44

Abstract: A display device is provided. The display device includes a substrate, and a light-emitting unit disposed on the substrate. The light-emitting unit includes a first conductive layer overlapping a second conductive layer, a first semiconductor layer disposed between the first conductive layer and the second conductive layer, a second semiconductor layer disposed between the first semiconductor layer and the first conductive layer, a quantum well structure disposed between the first semiconductor layer and the second semiconductor layer, and a via hole penetrated through the first semiconductor layer and the quantum well structure. The second conductive layer is electrically connected with the second semiconductor layer through a conductive material disposed in the via hole.

公开(公告)号：US20140063396A1

公开(公告)日：2014-03-06

申请号：US14015234

申请日：2013-08-30

Applicant: InnoLux Corporation

Inventor： Kuan-Feng Lee ,  Ming-Chang Lin ,  Ying-Tong Lin

IPC: G02F1/1368

CPC classification number: G02F1/1368 ,  G02F1/133345 ,  G02F1/136227

Abstract: A display panel includes a thin film transistor substrate, an opposite substrate and a liquid crystal layer. A thin film transistor is disposed on a substrate and has a drain. A first insulating layer is disposed on the drain and has a first via above the drain. A planarization layer is disposed on the first insulating layer and has a second via above the drain. The first via and the second via are partially overlapped to form an overlap portion. A second insulating layer is disposed on the planarization layer. A pixel electrode layer is disposed on the second insulating layer and in the overlap portion to connect to the drain. The opposite substrate is disposed opposite to the thin film transistor substrate. The liquid crystal layer is disposed between the thin film transistor substrate and the opposite substrate.

Abstract translation: 显示面板包括薄膜晶体管基板，相对基板和液晶层。 薄膜晶体管设置在基板上并具有漏极。 第一绝缘层设置在漏极上并且在漏极上方具有第一通孔。 平坦化层设置在第一绝缘层上，并且在漏极上方具有第二通孔。 第一通孔和第二通孔部分重叠以形成重叠部分。 第二绝缘层设置在平坦化层上。 像素电极层设置在第二绝缘层上和重叠部分中以连接到漏极。 相对的基板与薄膜晶体管基板相对设置。 液晶层设置在薄膜晶体管基板和相对基板之间。