公开(公告)号：US20230317736A1

公开(公告)日：2023-10-05

申请号：US18206590

申请日：2023-06-06

Applicant: InnoLux Corporation

Inventor： Chi-Lun Kao ,  Ming-Chun Tseng ,  Ker-Yih Kao ,  Wen-Chang Tsai ,  Chao-Chin Sung

IPC: H01L27/12 ,  H01L23/538

CPC classification number: H01L27/124 ,  H01L23/5384 ,  H01L23/5386

Abstract: An electronic device includes a substrate, a driving layer, an organic layer and a diode. The driving layer is disposed on the substrate, and the driving layer includes a thin film transistor. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The diode is disposed on the organic layer and overlapped with the through hole portion, the diode is electrically connected to the driving layer by a bonding pad overlapped with the through hole portion, and the diode is not overlapped with the thin film transistor.

公开(公告)号：US11830833B2

公开(公告)日：2023-11-28

申请号：US17363018

申请日：2021-06-30

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18 ,  H01L25/16

CPC classification number: H01L24/05 ,  H01L23/3192 ,  H01L25/162 ,  H01L25/167 ,  H05K1/111 ,  H05K1/181 ,  H01L24/32 ,  H01L2224/0502 ,  H01L2224/05013 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/35121 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

公开(公告)号：US20240047393A1

公开(公告)日：2024-02-08

申请号：US18489871

申请日：2023-10-19

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L24/05 ,  H01L25/162 ,  H05K1/111 ,  H01L23/3192 ,  H05K1/181 ,  H01L25/167 ,  H01L2924/35121 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/05073 ,  H01L2224/0502 ,  H01L2224/05573 ,  H01L2224/05564 ,  H01L2224/05553 ,  H01L2224/05013 ,  H01L2924/12041 ,  H01L2924/1426 ,  H05K2201/10522 ,  H05K2201/0989 ,  H05K2201/10106

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.

公开(公告)号：US20220028809A1

公开(公告)日：2022-01-27

申请号：US17363018

申请日：2021-06-30

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

公开(公告)号：US20200343271A1

公开(公告)日：2020-10-29

申请号：US16836807

申请日：2020-03-31

Applicant: InnoLux Corporation

Inventor： Chi-Lun Kao ,  Ming-Chun Tseng ,  Ker-Yih Kao ,  Wen-Chang Tsai ,  Chao-Chin Sung

IPC: H01L27/12 ,  H01L23/538

Abstract: An electronic device is provided in the present disclosure. The electronic device includes a substrate, a driving layer, an organic layer and a light emitting layer. The driving layer is disposed on the substrate. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The light emitting unit is disposed on the organic layer. The light emitting unit is electrically connected to the driving layer by a bonding pad. A ratio of an area of the through hole portion overlapped with the bonding pad to and area of the bonding pad is greater than or equal to 0.3 and less than or equal to 3 in a top view direction of the electronic device.

公开(公告)号：US11322489B2

公开(公告)日：2022-05-03

申请号：US16723095

申请日：2019-12-20

Applicant: InnoLux Corporation

Inventor： Hao-Jung Huang ,  Chao-Chin Sung

IPC: H01L25/13 ,  G09G3/32 ,  H01L23/498 ,  H01L33/62

Abstract: A tiled display device is provided. The tiled display device includes a first substrate, a second substrate and a light-emitting unit. The first substrate includes a first main substrate and a first flexible substrate. The first flexible substrate is disposed on the first main substrate. The second substrate is disposed adjacent to the first substrate. The light-emitting unit is disposed on the first flexible substrate. In addition, a portion of the light-emitting unit protrudes from an edge of the first main substrate.

公开(公告)号：US20230354521A1

公开(公告)日：2023-11-02

申请号：US18189211

申请日：2023-03-24

Applicant: Innolux Corporation

Inventor： Chueh-Yuan Nien ,  Chao-Chin Sung ,  Chien-Tzu Chu ,  Yu-Chien Kao ,  Li-Wei Sung

IPC: H05K1/11 ,  H05K3/28 ,  H05K1/14 ,  H05K3/32 ,  H05K3/10

CPC classification number: H05K1/111 ,  H05K3/28 ,  H05K1/145 ,  H05K3/321 ,  H05K3/103

Abstract: Disclosed are an electronic device and another electronic device. The electronic device includes a circuit substrate, a conductive adhesive, a driving element and a first protective layer. The circuit substrate includes a connection pad. The conductive adhesive covers the connection pad. The driving element is arranged on the connection pad, and is electrically connected to the circuit substrate through the conductive adhesive. Another electronic device includes a circuit substrate, a first electronic unit, a second electronic unit, and a first protective layer. The first electronic unit is arranged on the circuit substrate and has two side walls. The second electronic unit is arranged on the circuit substrate and has two side walls. The first protective layer at least surrounds a part of both side walls of the first electronic unit and a part of both side walls of the second electronic unit.