公开(公告)号：US20230117955A1

公开(公告)日：2023-04-20

申请号：US17746970

申请日：2022-05-18

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ker-Yih Kao ,  Cheng-Chi Wang ,  Kuang-Ming Fan ,  Chun-Hung Chen ,  Wen-Hsiang Liao ,  Ming-Hsien Shih

IPC: H01L23/00 ,  H01L21/469

Abstract: An electronic device including a connection element is provided. The connection element includes a first metal layer, a first insulation layer, and a second insulation layer. The first insulation layer is disposed on the first metal layer and has a first hole and a second hole. The second insulation layer is disposed on the first insulation layer. The first hole exposes a portion of the first metal layer, and the second insulation layer extends into the second hole. A method of fabricating an electronic device is also provided.

公开(公告)号：US20230178452A1

公开(公告)日：2023-06-08

申请号：US17828039

申请日：2022-05-31

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Liang-Lu Chen ,  Kuang-Ming Fan ,  Chia-Lin Yang ,  Chun-Hung Chen

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L21/66

CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L22/32 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2924/3511 ,  H01L2924/30105 ,  H01L2924/35121

Abstract: An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.

公开(公告)号：US20230129218A1

公开(公告)日：2023-04-27

申请号：US17746987

申请日：2022-05-18

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ker-Yih Kao ,  Cheng-Chi Wang ,  Kuang-Ming Fan ,  Chun-Hung Chen ,  Wen-Hsiang Liao ,  Ming-Hsien Shih

IPC: H01L23/00

Abstract: An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.