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公开(公告)号：US20240087104A1
公开(公告)日：2024-03-14
申请号：US18230105
申请日：2023-08-03
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
IPC: G06T7/00 , G06F18/213 , G06F18/40 , G06V10/25 , G06V10/40 , G06V10/771
CPC classification number: G06T7/0004 , G06F18/213 , G06F18/40 , G06T7/001 , G06V10/25 , G06V10/40 , G06V10/771 , G06T2207/30116 , G06T2207/30164
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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公开(公告)号：US12020415B2
公开(公告)日：2024-06-25
申请号：US17855130
申请日：2022-06-30
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
IPC: G06T7/00 , G06F18/213 , G06F18/40 , G06V10/25 , G06V10/40 , G06V10/771
CPC classification number: G06T7/0004 , G06F18/213 , G06F18/40 , G06T7/001 , G06V10/25 , G06V10/40 , G06V10/771 , G06T2207/30116 , G06T2207/30164
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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Patent Agency Ranking
公开(公告)号：US20210390678A1
公开(公告)日：2021-12-16
申请号：US17461773
申请日：2021-08-30
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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公开(公告)号：US11763443B2
公开(公告)日：2023-09-19
申请号：US17461773
申请日：2021-08-30
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
IPC: G06T7/00 , G06F18/40 , G06F18/213 , G06V10/25 , G06V10/771 , G06V10/40
CPC classification number: G06T7/0004 , G06F18/213 , G06F18/40 , G06T7/001 , G06V10/25 , G06V10/40 , G06V10/771 , G06T2207/30116 , G06T2207/30164
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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公开(公告)号：US20220335589A1
公开(公告)日：2022-10-20
申请号：US17855130
申请日：2022-06-30
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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公开(公告)号：US11132787B2
公开(公告)日：2021-09-28
申请号：US16506905
申请日：2019-07-09
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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公开(公告)号：US20200013156A1
公开(公告)日：2020-01-09
申请号：US16506905
申请日：2019-07-09
Applicant: Instrumental, Inc.
Inventor： Samuel Bruce Weiss , Anna-Katrina Shedletsky , Simon Kozlov , Tilmann Bruckhaus , Shilpi Kumar , Isaac Sukin , Ian Theilacker , Brendan Green
Abstract: One variation of a method for monitoring manufacture of assembly units includes: receiving selection of a target location hypothesized by a user to contain an origin of a defect in assembly units of an assembly type; accessing a feature map linking non-visual manufacturing features to physical locations within the assembly type; for each assembly unit, accessing an inspection image of the assembly unit recorded by an optical inspection station during production of the assembly unit, projecting the target location onto the inspection image, detecting visual features proximal the target location within the inspection image, and aggregating non-visual manufacturing features associated with locations proximal the target location and representing manufacturing inputs into the assembly unit based on the feature map; and calculating correlations between visual and non-visual manufacturing features associated with locations proximal the target location and the defect for the set of assembly units.
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