Systems and methods for device authentication in supply chain

    公开(公告)号:US12088695B2

    公开(公告)日:2024-09-10

    申请号:US17558627

    申请日:2021-12-22

    Abstract: A first semiconductor device includes a processor configured to generate a random number at initial test of a second semiconductor device after fabrication of the second semiconductor device in a supply chain related to the second semiconductor device, and send the generated random number to the second semiconductor device. The processor is further configured to receive a first signature that is signed over the sent random number by the second semiconductor device using a first private key that is stored in the second semiconductor device, among a first private and public key pair, and test the received first signature, using a first public key that is stored in the first semiconductor device, among the first private and public key pair, to determine whether the second semiconductor device is authenticated.

    Techniques For Replacing Logic Circuits In Modules With Configurable Circuits

    公开(公告)号:US20230222274A1

    公开(公告)日:2023-07-13

    申请号:US18124259

    申请日:2023-03-21

    CPC classification number: G06F30/323

    Abstract: A computer system is provided for protecting a circuit design for an application specific integrated circuit. The computer system includes a logic circuit replacement tool for identifying a module of logic circuitry for replacement in at least a portion of the circuit design. The logic circuit replacement tool generates a transformed circuit design for the application specific integrated circuit by replacing the logic circuitry in the module with a configurable circuit that performs a logic function of the logic circuitry when a bitstream stored in storage circuits in the configurable circuit configures the configurable circuit. The transformed circuit design includes the configurable circuit in the module.

    Systems And Methods For Logic Circuit Replacement With Configurable Circuits

    公开(公告)号:US20210294953A1

    公开(公告)日:2021-09-23

    申请号:US17337824

    申请日:2021-06-03

    Abstract: Methods and systems are provided for protecting a circuit design for an integrated circuit. Logic circuits are identified in at least a portion of the circuit design for replacement. The logic circuits in the circuit design are replaced with a bitstream and configurable circuits that comprise memory circuits. A transformed circuit design is generated for the integrated circuit that comprises the configurable circuits. The configurable circuits in the transformed circuit design perform logic functions of the logic circuits when the bitstream is stored in the memory circuits in the configurable circuits.

    Systems And Methods For Generating Redacted Circuit Designs For Integrated Circuits

    公开(公告)号:US20240311537A1

    公开(公告)日:2024-09-19

    申请号:US18120857

    申请日:2023-03-13

    CPC classification number: G06F30/31

    Abstract: A computer system is provided for protecting an original circuit design for an integrated circuit. The computer system includes a logic circuit replacement tool that generates a redacted circuit design for the integrated circuit by replacing logic circuits in the original circuit design with first and second configurable circuits that perform logic functions of the logic circuits when a bitstream stored in storage circuits configures the first and the second configurable circuits. The logic circuit replacement tool couples one of the storage circuits that stores a bit in the bitstream to an input in each of the first and the second configurable circuits in the redacted circuit design.

    Timing Model for Chip-to-Chip Connection in a Package

    公开(公告)号:US20240028815A1

    公开(公告)日:2024-01-25

    申请号:US18375299

    申请日:2023-09-29

    CPC classification number: G06F30/398 G06F2119/12

    Abstract: Integrated circuit devices, methods, and circuitry are provided for performing timing analysis for chip-to-chip connections between integrated circuits in a multichip package. A system may include an integrated circuit package and a computing system. The integrated circuit package may have a first integrated circuit connected to a second integrated circuit via a chip-to-chip connection. The chip-to-chip connection may also be connected to a package ball. The computing system may perform timing analysis on a circuit design for the first integrated circuit with respect the chip-to-chip connection based on user-specified parasitic data relating to the connection to the package ball.

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