公开(公告)号：USD864969S1

公开(公告)日：2019-10-29

申请号：US29639752

申请日：2018-03-08

Applicant: Intel Corporation

Designer： Aleksander Magi ,  David M. Collins

公开(公告)号：US10177801B2

公开(公告)日：2019-01-08

申请号：US14757983

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： David M. Collins ,  Douglas Satzger ,  Michael A. Hyde

IPC: H04B1/3888

Abstract: A flip device case for an electronic device is described herein. The flip device case includes a recess and a border. The recess is to receive the electronic device via an opening in the recess. The border is to be coupled with the recess and includes a plurality of flexible points. Manipulation of the border at one or more of the flexible points is to configure the flip device case in a position.

公开(公告)号：USD824384S1

公开(公告)日：2018-07-31

申请号：US29550448

申请日：2016-01-04

Applicant: INTEL CORPORATION

Designer： Aleksander Magi ,  David M. Collins ,  Yishan Chang ,  Nicholas W. Oakley ,  Randall W. Martin ,  Douglas Satzger

公开(公告)号：USD913215S1

公开(公告)日：2021-03-16

申请号：US29695842

申请日：2019-06-21

Applicant: Intel Corporation

Designer： David M. Collins ,  Duck Young Kong ,  Quinn Fitzgerald

公开(公告)号：US20200371563A1

公开(公告)日：2020-11-26

申请号：US16988851

申请日：2020-08-10

Applicant: Intel Corporation

Inventor： David M. Collins ,  Brett True Branch ,  Shashi R. Karpur ,  Samarth Alva ,  Yogesh Channaiah

IPC: G06F1/16 ,  H05K5/02 ,  H05K7/16

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a carrier plate, and a base. A first hinge can rotatably couple the first housing to the second housing and a carrier plate to the first housing and to the second housing. A second hinge can rotatably couple the carrier plate to the base.

公开(公告)号：USD895609S1

公开(公告)日：2020-09-08

申请号：US29630874

申请日：2017-12-22

Applicant: Intel Corporation

Designer： Stephen D. Berry ,  David M. Collins ,  Randall W. Martin

公开(公告)号：USD771034S1

公开(公告)日：2016-11-08

申请号：US29531727

申请日：2015-06-29

Applicant: Intel Corporation

Designer： Douglas Satzger ,  David M. Collins ,  Gadi Amit ,  Yoshikazu Hoshino ,  Maura Hoven ,  Jinwoo Kim ,  Luke D. Mastrangelo ,  Kebei Li

公开(公告)号：USD878362S1

公开(公告)日：2020-03-17

申请号：US29655626

申请日：2018-07-05

Applicant: Intel Corporation

Designer： David M. Collins ,  Randall W. Martin

公开(公告)号：USD867368S1

公开(公告)日：2019-11-19

申请号：US29629833

申请日：2017-12-15

Applicant: Intel Corporation

Designer： Aleksander Magi ,  David M. Collins

公开(公告)号：USD864970S1

公开(公告)日：2019-10-29

申请号：US29639753

申请日：2018-03-08

Applicant: Intel Corporation

Designer： Aleksander Magi ,  David M. Collins