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公开(公告)号：US09659889B2
公开(公告)日：2017-05-23
申请号：US14136908
申请日：2013-12-20
Applicant: Intel Corporation
Inventor： Mihir Oka , Xavier Brun , Dingying David Xu , Edward Prack , Kabirkumar Mirpuri , Saikumar Jayaraman
IPC: H01L23/00 , C08K3/36 , C08K3/22 , B23K1/20 , B23K1/00 , B23K26/362 , C09D179/02 , C08G73/02 , B23K101/42
CPC classification number: H01L24/11 , B23K1/0016 , B23K1/20 , B23K26/361 , B23K26/362 , B23K2101/42 , C08G73/0233 , C08K3/22 , C08K3/36 , C08K2003/2241 , C09D179/02 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/1181 , H01L2224/11849 , H01L2224/119 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/13347 , H01L2224/1339 , H01L2224/16145 , H01L2224/16225 , H01L2224/81191 , H01L2924/10253 , H01L2924/12042 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , C08L79/04 , C08L79/02
Abstract: This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.
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公开(公告)号：US09324680B2
公开(公告)日：2016-04-26
申请号：US14031414
申请日：2013-09-19
Applicant: Intel Corporation
Inventor： Kabirkumar Mirpuri
CPC classification number: H01L24/81 , B23K1/20 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13101 , H01L2224/16225 , H01L2224/81192 , H01L2224/81815 , H01L2225/06513 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/014 , H01L2924/12042 , H01L2924/15331 , H01L2924/1815 , H01L2924/20106 , H01L2924/351 , H05K3/3436 , H01L2924/00 , H01L2924/00014
Abstract: An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.
Abstract translation: 示出了包括焊料结构的电子器件和形成电互连的方法。 示出了焊接结构，其包括由具有第一熔融温度的第一焊料形成的焊球和将焊球耦合到一个或多个电连接焊盘的连接结构，该连接结构由第二焊料形成，第二焊料具有低于 第一个熔化温度。 示出了包括在焊料结构上形成的聚合物模具材料的电子器件。
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公开(公告)号：US20160240506A1
公开(公告)日：2016-08-18
申请号：US15137860
申请日：2016-04-25
Applicant: Intel Corporation
Inventor： Kabirkumar Mirpuri
IPC: H01L23/00 , H01L25/00 , H01L25/065
CPC classification number: H01L24/81 , B23K1/20 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13101 , H01L2224/16225 , H01L2224/81192 , H01L2224/81815 , H01L2225/06513 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/014 , H01L2924/12042 , H01L2924/15331 , H01L2924/1815 , H01L2924/20106 , H01L2924/351 , H05K3/3436 , H01L2924/00 , H01L2924/00014
Abstract: An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.
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