公开(公告)号：US20250113428A1

公开(公告)日：2025-04-03

申请号：US18478967

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Eng Huat Goh ,  Tin Poay Chuah ,  Kavitha Nagarajan ,  Telesphor Kamgaing ,  Poh Boon Khoo ,  Jiun Hann Sir

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

Abstract: Technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. The integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. An electromagnetic shield box can be positioned in the hole. Tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. The electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. Positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.

公开(公告)号：US20250052512A1

公开(公告)日：2025-02-13

申请号：US18447951

申请日：2023-08-10

Applicant: Intel Corporation

Inventor： Shantanu Kulkarni ,  Jeff Ku ,  Baomin Liu ,  Tongyan Zhai ,  Min Suet Lim ,  Chee Chun Yee ,  Eng Huat Goh ,  Jun Liao ,  Kavitha Nagarajan

IPC: F28D15/04

Abstract: Systems, apparatus, articles of manufacture, and methods related to multi-sectional vapor chambers for electronic devices are disclosed. An example vapor chamber includes a first panel, a second panel, and a wall extending between the first panel and the second panel to separate the vapor chamber into a first section and a second section between both the first panel and the second panel, the wall including insulation.

公开(公告)号：US20250008685A1

公开(公告)日：2025-01-02

申请号：US18216049

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Nirmala Bailur ,  Min Suet Lim ,  Tongyan Zhai ,  Chee Chun Yee ,  Ruander Cardenas ,  Lance Lin ,  Eng Huat Goh ,  Javed Shaikh ,  Jun Liao ,  Kavitha Nagarajan ,  Tin Poay Chuah ,  Martin M. Chang ,  Shantanu D. Kulkarni ,  Telesphor Kamgaing

IPC: H05K7/20 ,  F04D19/00 ,  F04D29/52 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.

公开(公告)号：US20250004044A1

公开(公告)日：2025-01-02

申请号：US18344869

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Vijay HOSAMANI ,  Vikas Mishra ,  Kavitha Nagarajan ,  Zaman Zaid Mulla

IPC: G01R31/28 ,  H05K1/02

Abstract: The present disclosure generally relates to an electronic system including a semiconductor package and a circuit board. The semiconductor package and the circuit board may include contact structures configurable to have an output terminal of one contact structure connected to an input terminal of another contact structure so as to render a continuous electrical pathway through the contact structures, wherein the contact structures may be configured in a daisy chain manner forming a series connection, and wherein the continuous electrical pathway may render an output pattern in response to an electrical stimulus introduced to the electronic system.

公开(公告)号：US20240234303A9

公开(公告)日：2024-07-11

申请号：US17972975

申请日：2022-10-25

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Telesphor Kamgaing ,  Chee Kheong Yoon ,  Chu Aun Lim ,  Eng Huat Goh ,  Jooi Wah Wong ,  Kavitha Nagarajan

IPC: H01L23/522 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01L28/10

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. Power delivery to the device is on the opposite side of the semiconductor devices. The integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.

公开(公告)号：US20220300048A1

公开(公告)日：2022-09-22

申请号：US17712010

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Jeff Ku ,  Fern Nee Tan ,  John Lang ,  Kavitha Nagarajan ,  Javed Shaikh ,  Deepak Sekar

IPC: G06F1/20 ,  G06F1/16 ,  H01L23/373 ,  H05K1/02 ,  H05K7/20

Abstract: Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

公开(公告)号：US20240234234A9

公开(公告)日：2024-07-11

申请号：US17972923

申请日：2022-10-25

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Telesphor Kamgaing ,  Ilan Ronen ,  Kavitha Nagarajan ,  Chee Kheong Yoon ,  Chu Aun Lim ,  Eng Huat Goh ,  Jooi Wah Wong

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/532

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L23/53233

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. Metal fill, such as copper, is formed within a portion of the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices and towards a heat spreader.

公开(公告)号：US20240136279A1

公开(公告)日：2024-04-25

申请号：US17972975

申请日：2022-10-24

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Telesphor Kamgaing ,  Chee Kheong Yoon ,  Chu Aun Lim ,  Eng Huat Goh ,  Jooi Wah Wong ,  Kavitha Nagarajan

IPC: H01L23/522 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01L28/10

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. Power delivery to the device is on the opposite side of the semiconductor devices. The integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.

公开(公告)号：US20240136243A1

公开(公告)日：2024-04-25

申请号：US17972923

申请日：2022-10-24

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Telesphor Kamgaing ,  Ilan Ronen ,  Kavitha Nagarajan ,  Chee Kheong Yoon ,  Chu Aun Lim ,  Eng Huat Goh ,  Jooi Wah Wong

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/532

CPC classification number: H01L23/367 ,  H01L23/42 ,  H01L23/53233

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. Metal fill, such as copper, is formed within a portion of the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices and towards a heat spreader.