公开(公告)号：US20240385654A1

公开(公告)日：2024-11-21

申请号：US18329148

申请日：2023-06-05

Applicant: Intel Corporation

Inventor： Jeff Ku ,  MING-SHENG Tsai ,  Twan Sing Loo ,  Jeffrey Ho ,  Songlin Zhou

IPC: G06F1/16 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.