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公开(公告)号：US20220174820A1
公开(公告)日：2022-06-02
申请号：US17671566
申请日：2022-02-14
Applicant: Intel Corporation
Inventor： Mooi Ling Chang , Tin Poay Chuah , Eng Huat Goh , Min Suet Lim , Twan Sing Loo
Abstract: In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.
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公开(公告)号：US20230395480A1
公开(公告)日：2023-12-07
申请号：US17834674
申请日：2022-06-07
Applicant: Intel Corporation
Inventor： Tin Poay Chuah , Jeff Ku , Min Suet Lim , Yew San Lim , Twan Sing Loo
IPC: H01L23/498 , H05K3/34 , H01L21/48 , H05K1/11
CPC classification number: H01L23/49816 , H01L23/49827 , H01L23/49838 , H05K3/3436 , H05K2201/10378 , H05K1/115 , H05K2201/10734 , H05K2201/0154 , H05K2201/10303 , H01L21/4853
Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.
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公开(公告)号：US12204370B2
公开(公告)日：2025-01-21
申请号：US17359224
申请日：2021-06-25
Applicant: Intel Corporation
Inventor： Jeff Ku , Jose Oviedo Salazar , Twan Sing Loo , Khai Ern See , Min Suet Lim
IPC: G06F1/16
Abstract: Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.
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公开(公告)号：US20210410341A1
公开(公告)日：2021-12-30
申请号：US17471396
申请日：2021-09-10
Applicant: Intel Corporation
Inventor： Boon Ping Koh , Twan Sing Loo , Yew San Lim , Tin Poay Chuah
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.
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公开(公告)号：US20240385654A1
公开(公告)日：2024-11-21
申请号：US18329148
申请日：2023-06-05
Applicant: Intel Corporation
Inventor： Jeff Ku , MING-SHENG Tsai , Twan Sing Loo , Jeffrey Ho , Songlin Zhou
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.
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Patent Agency Ranking
公开(公告)号：US20210397219A1
公开(公告)日：2021-12-23
申请号：US17359224
申请日：2021-06-25
Applicant: Intel Corporation
Inventor： Jeff Ku , Jose Oviedo Salazar , Twan Sing Loo , Khai Ern See , Min Suet Lim
IPC: G06F1/16
Abstract: Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.
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公开(公告)号：US20210120699A1
公开(公告)日：2021-04-22
申请号：US17132846
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Chee How Lim , Khai Ern See , Chin Kung Goh , Twan Sing Loo
Abstract: Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.
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公开(公告)号：US12284793B2
公开(公告)日：2025-04-22
申请号：US17754429
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Ritu Bawa , Ruander Cardenas , Kathiravan D , Jia Yan Go , Chin Kung Goh , Jeff Ku , Prakash Kurma Raju , Baomin Liu , Twan Sing Loo , Mikko Makinen , Columbia Mishra , Juha Paavola , Prasanna Pichumani , Daniel Ragland , Kannan Raja , Khal Ern See , Javed Shaikh , Gokul Subramaniam , George Baoci Sun , Xiyong Tian , Hua Yang , Mark Carbone , Vivek Paranjape , Nehakausar Pinjari , Hari Shanker Thakur , Christopher Moore , Gustavo Fricke , Justin Huttula , Gavin Sung , Sammi Wy Liu , Arnab Sen , Chun-Ting Liu , Jason Y. Jiang , Gerry Juan , Shih Wei Nien , Lance Lin , Evan Kuklinski
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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公开(公告)号：US20230017925A1
公开(公告)日：2023-01-19
申请号：US17946808
申请日：2022-09-16
Applicant: Intel Corporation
Inventor： Jeff Ku , Min Suet Lim , Tin Poay Chuah , Yew San Lim , Twan Sing Loo
Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.
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公开(公告)号：US20220225530A1
公开(公告)日：2022-07-14
申请号：US17699513
申请日：2022-03-21
Applicant: Intel Corporation
Inventor： Jeff Ku , Tongyan Zhai , Lance Lin , Min Suet Lim , Twan Sing Loo
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a first side and an opposite second side. A first air mover can be coupled to the first side of the support structure, where a motor of the first air mover is on the support structure and an air mover controller where the air mover controller controls the first air mover through trace in the support structure. In some examples, a second air mover can be located on the second side of the support structure, where a motor of the second air mover is on the second side of the support structure and the second air mover is controlled by the air mover controller through trace in the support structure. The support structure can be a printed circuit board or motherboard.
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