公开(公告)号：US20220407254A1

公开(公告)日：2022-12-22

申请号：US17352103

申请日：2021-06-18

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Zhe Chen ,  Steven A. Klein ,  Feifei Cheng ,  Srikant Nekkanty ,  Kemal Aygun ,  Michael E. Ryan ,  Pooya Tadayon

IPC: H01R12/72 ,  H01R43/16 ,  H01R13/17

Abstract: A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.