公开(公告)号：US20230197659A1

公开(公告)日：2023-06-22

申请号：US17556444

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Mukund Ayalasomayajula ,  Dinesh Padmanabhan Ramalekshmi Thanu ,  Rui Zhang ,  Xiao Lu ,  Robert Nickerson ,  Patrick Neel Stover

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L24/03 ,  H01L24/81 ,  H01L2924/1432 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047

Abstract: A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.