公开(公告)号：US20210051796A1

公开(公告)日：2021-02-18

申请号：US17088135

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Sami Heinisuo ,  Paul Gohlke ,  Kari Mansukoski

IPC: H05K1/02 ,  H05K3/46

Abstract: Embodiments of the present disclosure are directed to a substrate with a plurality of layers including a top layer, one or more intermediate layers and a bottom layer. Ferromagnetic material applied to a first of the one or more intermediate layers in an area underneath a magnetic source disposed on an outer surface of the top layer, where the ferromagnetic material is to provide a shield for signal routing traces in one or more other intermediate layers or the bottom layer underneath the first intermediate layer, from a magnetic field produced by the magnetic source. Other embodiments may be described and/or claimed.