公开(公告)号：US20250113460A1

公开(公告)日：2025-04-03

申请号：US18979203

申请日：2024-12-12

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Smit Kapila ,  Min Suet Lim ,  Surya Pratap Mishra ,  Kari Mansukoski ,  Shantanu D. Kulkarni

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.

公开(公告)号：US20250008697A1

公开(公告)日：2025-01-02

申请号：US18343970

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Shawn S. McEuen ,  Kari Mansukoski ,  Sami Markus Heinisuo ,  Cody Hougnon

IPC: H05K7/20

Abstract: Die contact torsional springs are disclosed. A disclosed lid assembly for use with a circuit board includes a lid; a lug, a crank rotatably coupled to the lug, the crank including a spine, a jog to apply force to the lid, and a lever arm extending from the spine to apply a rotational moment to the spine when pressed against a surface.

公开(公告)号：US20240389289A1

公开(公告)日：2024-11-21

申请号：US18319156

申请日：2023-05-17

Applicant: Intel Corporation

Inventor： Kari Mansukoski ,  Cody Kim Hougnon ,  Juha Paavola ,  Sami Markus Heinisuo ,  Sanna Mari Peurala

IPC: H05K9/00 ,  G06F1/16 ,  H05K1/02

Abstract: For example, an apparatus may include an Electromagnetic Interference (EMI) shield, which may be configured to provide EMI shielding for electronic circuitry on a Printed Circuit Board (PCB). For example, the EMI shield may be configured to include an EMI shield lid; and an EMI shield connector to electrically couple the EMI shield lid to at least one tube on the PCB to provide a ground to the EMI shield lid via the at least one tube. For example, the EMI shield connector may be configured to maintain the EMI shield lid over the electronic circuitry on the PCB.

公开(公告)号：US20250016930A1

公开(公告)日：2025-01-09

申请号：US18895796

申请日：2024-09-25

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Luis Alvarez Mata ,  Jia Yan Go ,  Smit Kapila ,  Chaitra Kotehal ,  Jeff Ku ,  Shantanu Kulkarni ,  Kari Mansukoski ,  Surya Pratap Mishra

IPC: H05K1/18

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for inductors of voltage regulators that are built into and/or around mounting holes of a printed circuit board. An example apparatus includes a printed circuit board that includes a plurality of layers and a mounting hole extending through the plurality of layers, and an inductor at least partially in the mounting hole between two or more of the plurality of layers.

公开(公告)号：US20250003695A1

公开(公告)日：2025-01-02

申请号：US18345597

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Kari Mansukoski ,  Sami Heinisuo

IPC: F28D15/04 ,  F28D15/02

Abstract: Techniques are disclosed for manufacturing a heat pipe that includes a variable wall thickness and/or a variable diameter. The heat pipe may be formed by subjecting a pipe to a thickness processing and an expansion processing. The heat pipe may include a first portion and a second portion. The first portion may have a first diameter and a first wall thickness. The second portion may have a second diameter larger than the first diameter, and a second wall thickness larger than the first wall thickness.

公开(公告)号：US20210051796A1

公开(公告)日：2021-02-18

申请号：US17088135

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： Sami Heinisuo ,  Paul Gohlke ,  Kari Mansukoski

IPC: H05K1/02 ,  H05K3/46

Abstract: Embodiments of the present disclosure are directed to a substrate with a plurality of layers including a top layer, one or more intermediate layers and a bottom layer. Ferromagnetic material applied to a first of the one or more intermediate layers in an area underneath a magnetic source disposed on an outer surface of the top layer, where the ferromagnetic material is to provide a shield for signal routing traces in one or more other intermediate layers or the bottom layer underneath the first intermediate layer, from a magnetic field produced by the magnetic source. Other embodiments may be described and/or claimed.

公开(公告)号：US12082332B2

公开(公告)日：2024-09-03

申请号：US17131166

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K1/0201 ,  H05K7/20163 ,  H05K7/2039 ,  G06F1/203

Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

公开(公告)号：US20240292539A1

公开(公告)日：2024-08-29

申请号：US18113414

申请日：2023-02-23

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Justin M Huttula ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/368 ,  H05K2201/10378

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a standoff interposer between an overlapping portion of a first circuit board and a second circuit board. In selected examples, electronic devices and methods described show one or more conductive pathways within a standoff interposer that provide electrical communication between circuit boards, such as data signals, power delivery, etc.

公开(公告)号：US20210112654A1

公开(公告)日：2021-04-15

申请号：US17131166

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K1/02 ,  H05K7/20

Abstract: thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.