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公开(公告)号:US11616192B2
公开(公告)日:2023-03-28
申请号:US16024599
申请日:2018-06-29
Applicant: Intel Corporation
Inventor: Tofizur Rahman , Christopher J. Wiegand , Justin S. Brockman , Daniel G. Ouellette , Angeline K. Smith , Andrew Smith , Pedro A. Quintero , Juan G. Alzate-Vinasco , Oleg Golonzka
Abstract: A memory device includes a perpendicular magnetic tunnel junction (pMTJ) stack, between a bottom electrode and a top electrode. In an embodiment, the pMTJ includes a fixed magnet, a tunnel barrier above the fixed magnet and a free magnet structure on the tunnel barrier. The free magnet structure includes a first free magnet on the tunnel barrier and a second free magnet above the first free magnet, wherein at least a portion of the free magnet proximal to an interface with the free magnet includes a transition metal. The free magnet structure having a transition metal between the first and the second free magnets advantageously improves the switching efficiency of the MTJ, while maintaining a thermal stability of at least 50 kT.
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公开(公告)号:US20200006635A1
公开(公告)日:2020-01-02
申请号:US16024599
申请日:2018-06-29
Applicant: Intel Corporation
Inventor: Tofizur Rahman , Christopher J. Wiegand , Justin S. Brockman , Daniel G. Ouellette , Angeline K. Smith , Andrew Smith , Pedro A. Quintero , Juan G. Alzate-Vinasco , Oleg Golonzka
Abstract: A memory device includes a perpendicular magnetic tunnel junction (pMTJ) stack, between a bottom electrode and a top electrode. In an embodiment, the pMTJ includes a fixed magnet, a tunnel barrier above the fixed magnet and a free magnet structure on the tunnel barrier. The free magnet structure includes a first free magnet on the tunnel barrier and a second free magnet above the first free magnet, wherein at least a portion of the free magnet proximal to an interface with the free magnet includes a transition metal. The free magnet structure having a transition metal between the first and the second free magnets advantageously improves the switching efficiency of the MTJ, while maintaining a thermal stability of at least 50 kT.
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