公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.