公开(公告)号：US12063759B2

公开(公告)日：2024-08-13

申请号：US16927701

申请日：2020-07-13

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

公开(公告)号：US20240357774A1

公开(公告)日：2024-10-24

申请号：US18758060

申请日：2024-06-28

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Methods, systems, and apparatus described herein relate to a conformable cold plate for fluid cooling applications. An example method includes re-shaping a tube to contour non-uniform surfaces; and assembling a fluid cooling assembly using the re-shaped tube, the re-shaped tube capable to transfer fluid for cooling of one or more devices.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.