公开(公告)号：US20240260193A1

公开(公告)日：2024-08-01

申请号：US18102394

申请日：2023-01-27

Applicant: Intel Corporation

Inventor： Herh Nan Chen ,  Kean Huat Leong ,  Sze Lin Mak ,  Muhammad Danial Asyraf Abd Rahman

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/115 ,  H05K1/144 ,  H05K1/145 ,  H05K3/3415 ,  H05K3/3431 ,  H05K2201/042 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/10636

Abstract: Microelectronic devices and systems include a decoupling capacitor module having any number of capacitors attached to a surface of a substrate such as a cored or coreless microelectronics board. The decoupling capacitor module is attached, by an opposing surface of the substrate, to a number of capacitors that are, in turn, mounted on a board such as a motherboard. Substrate mounted capacitors are vertically aligned with corresponding board mounted capacitors to provide vertically stacked capacitors.