公开(公告)号：US12063759B2

公开(公告)日：2024-08-13

申请号：US16927701

申请日：2020-07-13

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

公开(公告)号：US20180343773A1

公开(公告)日：2018-11-29

申请号：US15605802

申请日：2017-05-25

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Xudong Tang

IPC: H05K7/20

CPC classification number: H05K7/20809 ,  H05K7/20327 ,  H05K7/20727

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

公开(公告)号：US20240357774A1

公开(公告)日：2024-10-24

申请号：US18758060

申请日：2024-06-28

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Methods, systems, and apparatus described herein relate to a conformable cold plate for fluid cooling applications. An example method includes re-shaping a tube to contour non-uniform surfaces; and assembling a fluid cooling assembly using the re-shaped tube, the re-shaped tube capable to transfer fluid for cooling of one or more devices.

公开(公告)号：US10765039B2

公开(公告)日：2020-09-01

申请号：US15605802

申请日：2017-05-25

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Xudong Tang

IPC: H05K7/20

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.