公开(公告)号：US20190206777A1

公开(公告)日：2019-07-04

申请号：US15857207

申请日：2017-12-28

Applicant: Intel IP Corporation

Inventor： Sonja Koller ,  Lizabeth Keser ,  Bernd Waidhas ,  Georg Seidmann

IPC: H01L23/498 ,  H01L21/48 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H05K3/4007 ,  H05K2201/095 ,  H05K2201/10378

Abstract: An interposer for an electronic package including at least one angled via. The interposer can include a dielectric layer including a first surface and a second surface. The dielectric layer can include a normal axis perpendicular with the first or second surface. In an example, an angled via can include a first end located along the first surface and a second end located along the second surface. A longitudinal axis of the angled via can be extended between the first end and the second end. The longitudinal axis is disposed at an angle from the normal axis to form an angled via.