公开(公告)号：US20190279899A1

公开(公告)日：2019-09-12

申请号：US15917032

申请日：2018-03-09

Applicant: Intel IP Corporation

Inventor： Saravana Maruthamuthu ,  Shankar Chandrasekaran Jayendra ,  Shidlingeshwar Khatakalle

IPC: H01L21/768 ,  H01L49/02 ,  H01L21/3205

Abstract: Various embodiments include, for example, a noise suppression filter for a power-delivery network (PDN). In one exemplary embodiment, a capacitor device, which may be used as at least a portion of the noise suppression filter, includes a first conductive plate and a second conductive plate with a dielectric material formed between the first conductive plate and the second conductive plate. A floating conductive fill layer is formed within the dielectric material and between the first conductive plate and the second conductive plate. Other embodiments of capacitors, and methods of forming the capacitor, are disclosed.