公开(公告)号：US20170008760A1

公开(公告)日：2017-01-12

申请号：US14797013

申请日：2015-07-10

Applicant: InvenSense, Inc.

Inventor： Stephen LLOYD ,  Ilya GURIN

IPC: B81B7/00

CPC classification number: B81B7/0074 ,  B81B7/0054 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00238 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.

Abstract translation: 公开了一种在垂直堆叠的一个封装中组合MEMS衬底，CMOS衬底和另一个MEMS衬底的封装。 该封装包括传感器芯片，其还包括第一MEMS衬底和具有第一表面和第二表面的CMOS衬底，并且其中第一MEMS衬底附接到CMOS衬底的第一表面。 封装还包括具有第一表面和第二表面的第二MEMS衬底，其中第二MEMS衬底的第一表面附接到CMOS衬底的第二表面，并且第二MEMS衬底的第二表面附接到封装 基质。 第一MEMS基板，CMOS基板，第二MEMS基板和封装基板设有电连接。

公开(公告)号：US20190188365A1

公开(公告)日：2019-06-20

申请号：US16223116

申请日：2018-12-18

Applicant: InvenSense, Inc.

Inventor： Ilya GURIN ,  Karthik KATINGARI

IPC: G06F21/32 ,  G16H40/63 ,  G16H10/60

CPC classification number: G06F21/32 ,  G06K9/0002 ,  G16H10/60 ,  G16H40/63

Abstract: A medical device comprises a surface, an ultrasonic sensor, and a processor. The surface is configured to interact with skin of a patient during operation of the medical device. The ultrasonic sensor is disposed beneath the surface and configured to ultrasonically measure data with respect to a region above the surface. The processor is coupled with the ultrasonic sensor. Responsive to detection of a finger in contact with the surface, the processor is configured to operate the ultrasonic sensor to capture a fingerprint of the finger. Responsive to authentication that a person associated with the captured fingerprint is authorized to use the medical device, the processor is configured to activate operation of the medical device.

公开(公告)号：US20160094156A1

公开(公告)日：2016-03-31

申请号：US14501792

申请日：2014-09-30

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Michael DUEWEKE ,  Ilya GURIN ,  Joseph SEEGER

IPC: H02N11/00 ,  B81C1/00 ,  B81B7/02

CPC classification number: B81B3/0051 ,  B81B7/02 ,  B81B2203/0118 ,  H02N11/002

Abstract: A MEMS sensor is disclosed. The MEMS sensor includes a MEMS structure and a substrate coupled to the MEMS structure. The substrate includes a layer of metal and a layer of dielectric material. The MEMS structure moves in response to an excitation. A first over-travel stop is formed on the substrate at a first distance from the MEMS structure. A second over-travel stop on the substrate at a second distance from the MEMS structure. At least one electrode on the substrate at a third distance from the MEMS structure. The first, second and third distances are all different.

Abstract translation: 公开了一种MEMS传感器。 MEMS传感器包括耦合到MEMS结构的MEMS结构和衬底。 衬底包括金属层和电介质材料层。 MEMS结构响应于激发而移动。 在距离MEMS结构的第一距离处，在基板上形成第一超行程挡块。 在距离MEMS结构第二距离的基板上的第二超行程停止。 在距离MEMS结构三分之一距离的衬底上的至少一个电极。 第一，第二和第三距离都是不同的。