公开(公告)号：US20190226871A1

公开(公告)日：2019-07-25

申请号：US16370664

申请日：2019-03-29

Applicant: InvenSense, Inc.

Inventor： Doruk SENKAL ,  Joseph SEEGER

IPC: G01C25/00 ,  G01C19/5649 ,  G01C19/5776 ,  G01C19/5614 ,  G01C19/5726

Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.

公开(公告)号：US20190169018A1

公开(公告)日：2019-06-06

申请号：US15985283

申请日：2018-05-21

Applicant: InvenSense, Inc.

Inventor： Doruk SENKAL ,  Yang LIN ,  Houri JOHARI-GALLE ,  Joseph SEEGER

IPC: B81B7/00

Abstract: A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.

公开(公告)号：US20180128615A1

公开(公告)日：2018-05-10

申请号：US15866140

申请日：2018-01-09

Applicant: INVENSENSE, INC.

Inventor： Joseph SEEGER ,  Ozan ANAC

IPC: G01C19/5755 ,  G01C19/5733

CPC classification number: G01C19/5755 ,  G01C19/5733

Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction

公开(公告)号：US20160363445A1

公开(公告)日：2016-12-15

申请号：US14495786

申请日：2014-09-24

Applicant: InvenSense, Inc.

Inventor： Ozan ANAC ,  Joseph SEEGER

IPC: G01C19/5762

CPC classification number: G01C19/5762 ,  B81B3/0051 ,  B81B2201/0242 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747 ,  G01P15/0802

Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized

Abstract translation: 公开了用于修改弹簧质量结构的实施例，其最小化对MEMS传感器的不期望的非线性运动的影响。 修改包括在弹簧质量构造的旋转结构之间提供刚性元件的任何或任何组合，调整旋转结构之间的弹簧系统并将电消除系统耦合到旋转结构。 在这样做时，诸如不需要的二次谐波运动的不期望的非线性运动被最小化

公开(公告)号：US20160094156A1

公开(公告)日：2016-03-31

申请号：US14501792

申请日：2014-09-30

Applicant: InvenSense, Inc.

Inventor： Matthew Julian THOMPSON ,  Michael DUEWEKE ,  Ilya GURIN ,  Joseph SEEGER

IPC: H02N11/00 ,  B81C1/00 ,  B81B7/02

CPC classification number: B81B3/0051 ,  B81B7/02 ,  B81B2203/0118 ,  H02N11/002

Abstract: A MEMS sensor is disclosed. The MEMS sensor includes a MEMS structure and a substrate coupled to the MEMS structure. The substrate includes a layer of metal and a layer of dielectric material. The MEMS structure moves in response to an excitation. A first over-travel stop is formed on the substrate at a first distance from the MEMS structure. A second over-travel stop on the substrate at a second distance from the MEMS structure. At least one electrode on the substrate at a third distance from the MEMS structure. The first, second and third distances are all different.

Abstract translation: 公开了一种MEMS传感器。 MEMS传感器包括耦合到MEMS结构的MEMS结构和衬底。 衬底包括金属层和电介质材料层。 MEMS结构响应于激发而移动。 在距离MEMS结构的第一距离处，在基板上形成第一超行程挡块。 在距离MEMS结构第二距离的基板上的第二超行程停止。 在距离MEMS结构三分之一距离的衬底上的至少一个电极。 第一，第二和第三距离都是不同的。

公开(公告)号：US20150336792A1

公开(公告)日：2015-11-26

申请号：US14590839

申请日：2015-01-06

Applicant: InvenSense, Inc.

Inventor： Kegang HUANG ,  Jongwoo SHIN ,  Martin LIM ,  Michael Julian DANEMAN ,  Joseph SEEGER

IPC: B81B7/00

CPC classification number: B81C1/00301 ,  B81B7/0064 ,  B81B2207/098 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.

Abstract translation: 公开了一种在集成MEMS器件中制造电连接的方法。 该方法包括形成MEMS晶片。 形成MEMS晶片包括在第一半导体层中形成一个空腔，将第一半导体层与设置在第一半导体层和第二半导体层之间的电介质层结合到第二半导体层，并且通过第二半导体蚀刻至少一个通孔 层和介电层，并在第二半导体层上沉积导电材料并填充至少一个通孔。 形成MEMS晶片还包括图案化和蚀刻导电材料以形成一个间隔并在导电材料上沉积锗层，图案化和蚀刻锗层，以及图案化和蚀刻第二半导体层以限定一个MEMS结构。 该方法还包括将MEMS晶片接合到基底基板。

公开(公告)号：US20140213007A1

公开(公告)日：2014-07-31

申请号：US14033366

申请日：2013-09-20

Applicant: InvenSense, Inc.

Inventor： Kegang HUANG ,  Jongwoo SHIN ,  Martin LIM ,  Michael Julian DANEMAN ,  Joseph SEEGER

IPC: B81C1/00

CPC classification number: B81C1/00301 ,  B81B7/0064 ,  B81B2207/098 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/031

Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.

公开(公告)号：US20150135831A1

公开(公告)日：2015-05-21

申请号：US14606858

申请日：2015-01-27

Applicant: InvenSense, Inc.

Inventor： Steven S. NASIRI ,  Goksen G. YARALIOGLU ,  Joseph SEEGER ,  Babak TAHERI

IPC: G01P15/08 ,  G01P15/125

CPC classification number: G01P15/0888 ,  B60R2021/01327 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18

Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.

Abstract translation: 公开了一种用于测量旋转加速度的旋转传感器。 旋转传感器包括感测衬底; 至少两个检测质量和一组两个换能器。 所述至少两个检验质量块中的每一个经由至少一个弯曲部并且彼此电隔离地锚固到所述感测基板; 并且所述至少两个检测质量能够相对于所述感测基板围绕Z轴在平面内旋转，其中所述Z轴垂直于所述基板。 每个换能器可以响应于旋转传感器的旋转而感测相对于感测衬底的每个校准质量块的旋转。

公开(公告)号：US20200225038A1

公开(公告)日：2020-07-16

申请号：US16735351

申请日：2020-01-06

Applicant: INVENSENSE, INC.

Inventor： Ozan ANAC ,  Joseph SEEGER

IPC: G01C19/5762 ,  G01C19/5733 ,  G01C19/5747 ,  G01P15/08 ,  B81B3/00

Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.

公开(公告)号：US20180073875A1

公开(公告)日：2018-03-15

申请号：US15814373

申请日：2017-11-15

Applicant: INVENSENSE, INC.

Inventor： Ozan ANAC ,  Joseph SEEGER

IPC: G01C19/5762 ,  G01P15/08 ,  G01C19/5747 ,  B81B3/00 ,  G01C19/5733

CPC classification number: G01C19/5762 ,  B81B3/0051 ,  B81B2201/0242 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747 ,  G01P15/0802

Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.