公开(公告)号：US20230087021A1

公开(公告)日：2023-03-23

申请号：US17733720

申请日：2022-04-29

Applicant: InvenSense, Inc.

Inventor： Roberto Brioschi ,  Vijay Wakharkar ,  Monisha Sharma

IPC: B81B7/00 ,  B81C1/00 ,  G01L19/06

Abstract: Microelectromechanical system (MEMS) packages and methods of making thereof. A MEMS package includes at least one MEMS device disposed on a base substrate and a lid disposed on the base substrate. The lid is configured to enclose the at least one MEMS device. The lid includes a body portion configured to be coupled to the base substrate, a ceiling portion and a membrane. The ceiling portion, the body portion and the ceiling portion form a cavity in which the at least one MEMS device is enclosed. The membrane is configured to be in contact with the ceiling portion. The membrane is formed from a filtering fabric and is configured to substantially block one or more of liquids and contaminants from passing into the cavity.