公开(公告)号：US09947633B2

公开(公告)日：2018-04-17

申请号：US15195617

申请日：2016-06-28

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Thomas DiStefano

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/14 ,  H01L23/293 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13181 ,  H01L2224/1319 ,  H01L2224/14051 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/17055 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81345 ,  H01L2224/81903 ,  H01L2224/8388 ,  H01L2924/07025 ,  H01L2924/00

Abstract: Deformable conductive contacts are provided. A plurality of deformable contacts on a first substrate may be joined to a plurality of conductive pads on a second substrate during die level or wafer level assembly of microelectronics. Each deformable contact complies to a degree that is related to the amount of joining pressure between the first substrate and the second substrate. Since an individual contact can make the conductive coupling within a range of distances from a target pad, an array of the deformable contacts provides tolerance and compliance when there is some variation in height of the conductive elements on either side of the join. A flowable underfill may be provided to press the deformable contacts against opposing pads and to permanently join the surfaces at a fixed distance. The deformable contacts may include a wiping feature to clear their target pads for establishing improved metal-to-metal contact or a thermocompression bond.

公开(公告)号：US20170373033A1

公开(公告)日：2017-12-28

申请号：US15195617

申请日：2016-06-28

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Thomas DiStefano

IPC: H01L23/00 ,  H01L23/29

CPC classification number: H01L24/14 ,  H01L23/293 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13181 ,  H01L2224/1319 ,  H01L2224/14051 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/17055 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81345 ,  H01L2224/81903 ,  H01L2224/8388 ,  H01L2924/07025 ,  H01L2924/00

Abstract: Deformable conductive contacts are provided. A plurality of deformable contacts on a first substrate may be joined to a plurality of conductive pads on a second substrate during die level or wafer level assembly of microelectronics. Each deformable contact complies to a degree that is related to the amount of joining pressure between the first substrate and the second substrate. Since an individual contact can make the conductive coupling within a range of distances from a target pad, an array of the deformable contacts provides tolerance and compliance when there is some variation in height of the conductive elements on either side of the join. A flowable underfill may be provided to press the deformable contacts against opposing pads and to permanently join the surfaces at a fixed distance. The deformable contacts may include a wiping feature to clear their target pads for establishing improved metal-to-metal contact or a thermocompression bond.