公开(公告)号：US07478474B2

公开(公告)日：2009-01-20

申请号：US11408541

申请日：2006-04-20

Applicant: Issei Koga

Inventor： Issei Koga

IPC: H05K3/30

CPC classification number: H05K1/0218 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/1515 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0919 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49789

Abstract: A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

Abstract translation: 金属膜和接地图可靠地连接在一起，以实现电子电路单元的电气屏蔽。 在电子电路单元中，金属膜设置在密封树脂部分的顶表面上，用于掩埋电子部件，密封树脂部分的彼此相对的侧表面和多层的侧表面 基板彼此相对。 金属膜连接到设置在多层基板的顶表面上或多层基板的层叠层之间的接地图案。 因此，与现有技术相比，可以通过金属膜实现优异的电屏蔽效果。 由于金属膜形成在密封树脂的侧表面和多层基板的侧表面上，所以当通过电镀方法形成金属膜时，在现有技术中可能不提供盲孔。 因此，可以实现电镀液的良好的循环，这导致接地图案和金属膜之间的确定连接之间的确定的连接。

公开(公告)号：US08223132B2

公开(公告)日：2012-07-17

申请号：US12561232

申请日：2009-09-16

Applicant: Issei Koga ,  Noriyuki Machida

Inventor： Issei Koga ,  Noriyuki Machida

IPC: G06F3/044

CPC classification number: G06F1/169 ,  G06F1/1616

Abstract: Electrodes E1 and E2 are formed on a substrate SB1. Electrodes E3 to E10 are formed on the substrate SB1 to surround the electrodes E1 and E2. Conductive lines L1 and L2 extend over the substrate SB1 to sandwich the electrodes E6 and E7, and are connected to the electrodes E1 and E2. An insulating sheet, having a surface exposed to outside, covers the electrodes E1 to E10 and conductive lines L1 to L10. When a finger contacts the insulating sheet, if there are the electrodes E1 and E2 on a bottom side of a contact portion, capacitances of the electrical conductors EC1 and EC2 are changed. When the finger contacts the insulating sheet, if there are the electrodes E7 and the conductive line L1 that extends in the vicinity thereof on the bottom side of the contact portion, capacitances of the electrical conductors EC7 and EC1 are changed.

Abstract translation: 电极E1和E2形成在基板SB1上。 电极E3〜E10形成在基板SB1上，以包围电极E1和E2。 导电线L1和L2在基板SB1上延伸以夹持电极E6和E7，并连接到电极E1和E2。 具有暴露于外部的表面的绝缘片覆盖电极E1至E10和导线L1至L10。 当手指接触绝缘片时，如果在接触部分的底侧存在电极E1和E2，则电导体EC1和EC2的电容改变。 当手指接触绝缘片时，如果在接触部分的底侧有电极E7和延伸在其附近的导线L1，则电导体EC7和EC1的电容改变。

公开(公告)号：US20060266547A1

公开(公告)日：2006-11-30

申请号：US11408541

申请日：2006-04-20

Applicant: Issei Koga

Inventor： Issei Koga

IPC: H05K7/06

CPC classification number: H05K1/0218 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/1515 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0919 ,  Y10T29/49146 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49789

Abstract: A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an electronic component, the side surfaces of the sealing resin portion that are opposite to each other, and the side surfaces of the multi-layered substrate that are opposite to each other. The metallic film is connected to the grounding patterns that are provided on the top surface of the multi-layered substrate or between the laminated layers of the multi-layered substrate. Therefore, it is possible to achieve a superior electrical shielding effect through the metallic film, as compared with the related art. Since the metallic film is formed on the side surfaces of the sealing resin and the side surfaces of the multi-layered substrate, when the metallic film is formed by a plating method, the blind hole may not be provided in the related art. Therefore, it is possible to achieve the superior circulation of the plating liquid, which results in sure connection between the sure connection between the grounding pattern and the metallic film.

Abstract translation: 金属膜和接地图可靠地连接在一起，以实现电子电路单元的电气屏蔽。 在电子电路单元中，金属膜设置在密封树脂部分的顶表面上，用于掩埋电子部件，密封树脂部分的彼此相对的侧表面和多层的侧表面 基板彼此相对。 金属膜连接到设置在多层基板的顶表面上或多层基板的层叠层之间的接地图案。 因此，与现有技术相比，可以通过金属膜实现优异的电屏蔽效果。 由于金属膜形成在密封树脂的侧表面和多层基板的侧表面上，所以当通过电镀方法形成金属膜时，在现有技术中可能不提供盲孔。 因此，可以实现电镀液的良好的循环，这导致接地图案和金属膜之间的确定连接之间的确定的连接。