公开(公告)号：US20240055367A1

公开(公告)日：2024-02-15

申请号：US18363773

申请日：2023-08-02

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： EunByeol LEE ,  DooSoub SHIN ,  YeJin PARK ,  HyukCheon KWON

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3128 ,  H01Q1/2283

Abstract: Provided is a method for forming a partial shielding for an electronic assembly, comprising: providing an electronic assembly mounted on a mother board, wherein the electronic assembly comprises a substrate, and at least one electronic component and a conductive pattern mounted on a top surface of the substrate; disposing a mask onto the substrate to cover the at least one electronic component; forming an encapsulant layer on the mother board to encapsulate at least the electronic assembly; forming a trench through the encapsulant layer to expose at least a portion of the conductive pattern and at least a portion of lateral surfaces of the mask; forming a shielding layer on the mother board to cover the encapsulant layer and fill in the trench; and detaching the mask from the mother board.