公开(公告)号：US20250031317A1

公开(公告)日：2025-01-23

申请号：US18765342

申请日：2024-07-08

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  Heesoo LEE

IPC: H05K3/34 ,  H05K1/18

Abstract: A method for mounting an electronic device on a flexible substrate is disclosed. The method comprising: providing the flexible substrate with conductive patterns on its front surface; forming solder bumps on the conductive patterns; dispensing a thermosetting material on the front surface of the flexible substrate; attaching the electronic device on the flexible substrate via the solder bumps and the thermosetting material; heating the flexible substrate to a first temperature to cure the thermosetting material; and heating the flexible substrate to a second temperature higher than the first temperature to reflow the solder bumps.