公开(公告)号：US20220408565A1

公开(公告)日：2022-12-22

申请号：US17857664

申请日：2022-07-05

Applicant: Jabil Inc.

Inventor： Weiping (aka Jonathan) Wu ,  Mohd Yusuf Tura Ali ,  Zambri Samsudin

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  C25D7/00

Abstract: An electronic circuit, comprising: an integrated substrate structure comprising one or more electrically conductive traces comprising plating on a laser-etched, non-conductive isolated portion of the integrated substrate structure defining each electrically conductive trace; one or more electrically conductive pads at one or more predetermined positions along the one or more electrically conductive traces; and an electrical component surface mounted to the at least one electrically conductive pad with interconnect and bonding material.

公开(公告)号：US20210360781A1

公开(公告)日：2021-11-18

申请号：US17053234

申请日：2018-05-08

Applicant: Jabil Inc.

Inventor： Fakhrozi Che Ani ,  Zambri Bin Samsudin ,  Mohd Yusuf Tura Ali ,  Zulkifli Ahmad

IPC: H05K1/02 ,  C09D11/52 ,  C09D11/102 ,  H05K1/03 ,  C08K3/08 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/12 ,  C08K5/549

Abstract: A system and method for forming a stretchable conductive circuit package that utilizes an addition and condensation mechanism incorporated into one system. When the stretchable conductive ink is used in a circuit package, the circuit package has high reliability and durability.