公开(公告)号：US20240098895A1

公开(公告)日：2024-03-21

申请号：US18355167

申请日：2023-07-19

Applicant: Jabil Inc.

Inventor： Lun Hao Tung ,  Lai Ming Lim ,  Zambri Samsudin

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/0283 ,  H05K1/181 ,  H05K2201/09236 ,  H05K2201/0939

Abstract: A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

公开(公告)号：US20220408565A1

公开(公告)日：2022-12-22

申请号：US17857664

申请日：2022-07-05

Applicant: Jabil Inc.

Inventor： Weiping (aka Jonathan) Wu ,  Mohd Yusuf Tura Ali ,  Zambri Samsudin

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/18 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  C25D7/00

Abstract: An electronic circuit, comprising: an integrated substrate structure comprising one or more electrically conductive traces comprising plating on a laser-etched, non-conductive isolated portion of the integrated substrate structure defining each electrically conductive trace; one or more electrically conductive pads at one or more predetermined positions along the one or more electrically conductive traces; and an electrical component surface mounted to the at least one electrically conductive pad with interconnect and bonding material.

公开(公告)号：US20240088544A1

公开(公告)日：2024-03-14

申请号：US18447613

申请日：2023-08-10

Applicant: Jabil Inc.

Inventor： Yen San Loh ,  Lai Ming Lim ,  Zambri Samsudin

IPC: H01Q1/27 ,  H01Q1/38 ,  H05K1/02

CPC classification number: H01Q1/273 ,  H01Q1/38 ,  H05K1/028 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154

Abstract: A flexible composite substrate for a wearable antenna includes a fabric sheet and a single-layer dielectric film immersed into the fabric sheet. The single-layer dielectric film includes a dielectric resin matrix and a low dielectric loss material which is mixed with the dielectric resin matrix and which serves as a wireless functional dielectric interface material.

公开(公告)号：US20240040706A1

公开(公告)日：2024-02-01

申请号：US18319870

申请日：2023-05-18

Applicant: Jabil Inc.

Inventor： Muhammad Irsyad Bin Suhaimi ,  Lai Ming Lim ,  Zambri Samsudin

IPC: H05K3/22 ,  H05K3/30 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K3/225 ,  H05K3/305 ,  H05K3/32 ,  H05K1/111 ,  H05K2203/068 ,  H05K2203/176 ,  H05K1/181

Abstract: A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.