Abstract:
A case for holding a wire-wound magnetic core or other electrical component so that the leads can be automatically inserted on a circuit board which employs a base portion that is shaped and dimensioned for compatibility with conventional automatic insertion equipment. The base includes both plastically-deformable cantilever lead traps for mechanically gripping the leads to secure the component on the base as well as circular notches in the slots that define predetermined positions on the base at which to grip the leads to enable use of the case for automatic insertion.
Abstract:
A self leaded holder for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, lead ports extending from the cavity through the sides, an inductance coil mounted in the cavity, and a lead extending from the coil via the lead ports to and wound a partial turn around each of the lead support members and disposed for surface bonding to a PC board.
Abstract:
A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.
Abstract:
An apparatus for automatically processing the wire ends of cores includes a forming die for bending the axially projecting wire ends back to project parallel to one another generally away from the core. Cores are received in a receiving station aligned with the forming die and orientated so that the wire ends are spaced as far as possible from the die. When the wire ends are sensed to be in the correct orientation, an actuator is operated to push the core through the forming die. The core with its wire ends bent back is then preferably stepped through a series of processing stations to trim and tin the wire ends and then ejected from the machine. A series of cores can be stepped continuously one after the other through the machine.
Abstract:
A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes. The leads are inserted into the through-holes such that they protrude below the bottom surface of the base element, thereby facilitating soldering of all such connections in a single process step. This arrangement reduces manufacturing and labor costs and increases component and overall package reliability.
Abstract:
A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations.
Abstract:
An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.
Abstract:
An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.
Abstract:
Disclosed is an apparatus for simultaneously winding multiple strands of wire into turns about a toroidal core in rapid fashion. The apparatus includes a U-shaped wire receiving channel having a semi-circular portion with a gap and a pair of open-ended legs. The ends of the channel legs are positioned adjacent opposite sides of a rotatably mounted drum which is driven by a resilient endless belt engaging approximately one half of its annular outer surface. A toroidal core is supplied and rigidly supported in the gap by a core feeding mechanism. A grooved gap crosser is thereafter extended through the central opening of the core to bridge the gap and complete the channel. A pair of pinch roller type feed/brake mechanisms propel and guide the leading ends of the wires into the channel, through the core opening, and up one channel leg to the drum. There the wires are frictionally held between the drum and the belt and they are positively driven into the other channel leg, through the core opening, and back to the drum. Continued feeding of the wire results in the formation of a coil having a plurality of vertically stacked, oval-shaped loops which extend through the core opening and are alternately made of different ones of the wires. Thereafter, staggered braking of the trailing ends of the wires causes the loops to be successively peeled radially inwardly from the channel and the drum as the coil is continuously circulated. The loops are tightened into turns about the core as it is slowly rotated about its axis by the core feeding mechanism. First and second shear mechanisms cut off the trailing and leading ends of the wires at the beginning and end of the winding operation, respectively.