ELECTRONIC APPARATUS
    4.
    发明申请

    公开(公告)号:US20210280413A1

    公开(公告)日:2021-09-09

    申请号:US17328031

    申请日:2021-05-24

    Abstract: An electronic apparatus is provided and includes a first substrate comprising a first conductive layer; a second substrate which is opposed to the first conductive layer and is separated from the first conductive layer, the second substrate including a second conductive layer, and a first hole penetrating the second substrate; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole, wherein the connecting material consists of a single material; and the second conductive layer is located on the second substrate on a side opposite to a side that is opposed to the first conductive layer.

    DISPLAY DEVICE
    5.
    发明申请

    公开(公告)号:US20210042491A1

    公开(公告)日:2021-02-11

    申请号:US17077224

    申请日:2020-10-22

    Abstract: A display panel including a display function layer displaying an image in a display area, a cover member including a first face and a second face disposed on an opposite side of the first face and faces the display panel, and a fingerprint sensor including a plurality of first detection electrodes disposed in a sensor base and configured to detect unevenness of an object brought into contact with or approaching the first face of the cover member, a shield electrode disposed to face the plurality of first detection electrodes and configured to suppress a change in capacitance between the first detection electrodes and the shield electrode, and switching elements disposed in correspondence with the first detection electrodes, the fingerprint sensor being arranged between the cover member and the display panel and arranged to overlap with the display area when viewed in a direction perpendicular to the first face are included.

    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20200026119A1

    公开(公告)日:2020-01-23

    申请号:US16588461

    申请日:2019-09-30

    Abstract: According to one embodiment, an electronic device includes a first substrate, a second substrate, an insulating film and a connecting material. The first substrate includes a first insulating substrate and a first conductive layer. The second substrate includes a second insulating substrate and a second conductive layer, and has a first through hole. The insulating film has a second through hole connected to the first through hole and penetrating to the first conductive layer. The connecting material is located in the first and the second through holes and electrically connects the first conductive layer and the second conductive layer. A width of the second through hole is less than a width of the first through hole.

    CONDUCTING STRUCTURE
    8.
    发明申请

    公开(公告)号:US20230116970A1

    公开(公告)日:2023-04-20

    申请号:US18085286

    申请日:2022-12-20

    Abstract: A conducting structure is provided and includes a first layer; a first terminal on the first layer; a second layer overlapping the first layer via the first terminal; a second terminal on the second layer; a first hole which penetrates the second layer and the second terminal; an organic insulating layer located between the first terminal and the second layer, and having a second hole connected to the first hole; and a connecting material provided in the first and second holes to electrically connect the first terminal and the second terminal to each other, wherein a diameter of the second hole is greater than a diameter of the first hole.

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