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公开(公告)号:US20240148251A1
公开(公告)日:2024-05-09
申请号:US18387992
申请日:2023-11-08
Applicant: Japan Display Inc.
Inventor: Hiroki SUGIYAMA , Takahiro SHOJI , Yoshihide OHUE , Kaoru TAKETA
IPC: A61B5/00
CPC classification number: A61B5/0059
Abstract: According to an aspect, a detection device includes: a substrate; a photodiode in which a lower electrode, a semiconductor layer, and an upper electrode are stacked on the substrate in the order as listed; a transistor provided in the photodiode; an insulating layer provided between layers of the substrate and the photodiode; and a planarizing layer covering the insulating layer. The insulating layer comprises a projecting portion that projects toward the photodiode in a direction orthogonal to the substrate. The planarizing layer has a contact hole provided in a position that is below the photodiode and overlaps the projecting portion of the insulating layer. The photodiode is provided on an upper side of the planarizing layer and is also provided so as to cover the contact hole. The lower electrode of the photodiode is electrically coupled to the transistor at a bottom of the contact hole.
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公开(公告)号:US20230366733A1
公开(公告)日:2023-11-16
申请号:US18195634
申请日:2023-05-10
Applicant: Japan Display Inc.
Inventor: Hiroki SUGIYAMA , Takahiro SHOJI , Kaoru TAKETA
IPC: G01J1/44
CPC classification number: G01J1/44 , G01J2001/446
Abstract: According to an aspect, a detection device includes: a substrate; a photodiode in which a lower electrode, a semiconductor layer, and an upper electrode are stacked on the substrate in the order as listed; a transistor provided in the photodiode; and an insulating layer provided between layers of the transistor and the photodiode. The insulating layer has a contact hole provided in a central portion of the photodiode in plan view. The lower electrode of the photodiode is provided on the insulating layer, is provided continuously in an area overlapping the contact hole, and is electrically coupled to the transistor at a bottom of the contact hole. A first opening is provided in an area of the upper electrode that overlaps the contact hole.
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