公开(公告)号：US20140340593A1

公开(公告)日：2014-11-20

申请号：US14264239

申请日：2014-04-29

Applicant: Japan Display Inc.

Inventor： Yuji SATO ,  Yoshikazu YOMOGIHARA

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10 ,  G02F1/1333

CPC classification number: G02F1/13338 ,  G02F1/133512 ,  G06F3/0412 ,  G06F3/044 ,  Y10T29/49162

Abstract: An electronic component includes a substrate, a shielding layer formed on the substrate and a wiring substrate connected to the substrate. A pad group is formed on an overlap region on which the wiring substrate is arranged on the substrate. A first alignment pattern is formed on the substrate and extending to outside of the overlap region beyond a peripheral portion of the overlap region. A second alignment pattern is formed on the substrate and extending to outside of the overlap region beyond the peripheral portion of the overlap region. The pad group, the first and second alignment patterns are formed on the shielding layer. The first alignment pattern extends in a different direction from the direction of the second alignment pattern.

Abstract translation: 电子部件包括基板，形成在基板上的屏蔽层和与基板连接的布线基板。 在基板上配置有布线基板的重叠区域上形成焊盘组。 第一对准图案形成在基板上并延伸到重叠区域的外部超过重叠区域的周边部分。 第二对准图案形成在基板上并且延伸到重叠区域的外部超过重叠区域的周边部分。 衬垫组，第一和第二对准图案形成在屏蔽层上。 第一对准图案沿与第二对准图案的方向不同的方向延伸。