Abstract:
A display device having bi-directional scan mechanism includes a plurality of gate lines, a first shift register circuit and a second shift register circuit. The first shift register circuit includes a plurality of forward shift register stages. The second shift register circuit includes a plurality of backward shift register stages. Each of the gate lines is electrically connected to both a corresponding forward shift register stage and a corresponding backward shift register stage. When the first shift register circuit is enabled, the forward shift register stages are employed to provide plural forward gate signals sequentially enabled for scanning the gate lines based on a first sequence. When the second shift register circuit is enabled, the backward shift register stages are employed to provide plural backward gate signals sequentially enabled for scanning the gate lines based on a second sequence opposite to the first sequence.
Abstract:
A display panel including a first substrate, a second substrate, and a liquid crystal layer. The first substrate comprises a display region and a peripheral circuit region adjacent to the display region, and the first substrate includes a pixel array, a plurality of test shorting bars, and a plurality of wires. The pixel array is disposed in the display region. The test shorting bars are disposed in the peripheral circuit region. The wires are disposed in the peripheral circuit region and electrically connected with the pixel array. Moreover, at least one wire and one of the test shorting bars respectively share a part for connecting with each other and forming a common trace. Additionally, the second substrate is disposed opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate.
Abstract:
A hydraulic buffer device includes a first chamber, a second chamber, and a buffering space disposed under the first and second chambers, an air bladder disposed in the buffering space, an oil chamber disposed above the first and second chambers and divided by a piston into upper and lower chamber portions, and an annular passage disposed around the oil chamber. When the piston is moved downwardly within the oil chamber, the hydraulic oil flows from the lower chamber portion into the buffering space via the first chamber to contract the air bladder so that, upon expansion of the air bladder, air pressure in the air bladder pushes the hydraulic oil to flow from the buffering space into the upper chamber portion via the second chamber and the annular passage.
Abstract:
The present invention relates to a pull-down control circuit and a shift register of using same. In one embodiment, the pull-down control circuit includes a release circuit and four transistors T4, T5, T6 and T7 electrically coupled to each other. The release circuit is adapted for causing the transistor T5 to be turned on and off alternately, thereby substantially reducing the stress thereon, improving the reliability and prolonging the lifetime of the shift register.
Abstract:
An interconnect structure of an integrated circuit having improved reliability and a method for forming the same are provided. The method includes providing a substrate, forming a dielectric layer overlying the substrate, performing a first shrinking process, wherein the dielectric layer shrinks and has a first shrinkage rate, forming a conductive feature in the dielectric layer after the step of performing the first shrinking process, and performing a second shrinking process after the step of forming the conductive feature, wherein the dielectric layer substantially shrinks and has a second shrinkage rate.
Abstract:
An array substrate having a display region and a peripheral circuit region adjacent to the display region is provided. The array substrate includes a pixel array, a plurality of test shorting bars and a plurality of wires. The pixel array is disposed in the display region. The test shorting bars are disposed in the peripheral circuit region. The wires electrically connected with the pixel array are disposed in the peripheral circuit region. Specially, at least one wire and the test shorting bar share a part for connecting each other and the part forms a common trace.
Abstract:
A display panel includes an active device array substrate, an opposite substrate, and a liquid crystal layer. The active device array substrate includes a substrate and further includes a pixel array, signal lines, and first and second repairing lines all disposed on the substrate. The signal lines electrically connect the pixel array. The first repairing line includes first and second line segments respectively located on first and second sides of the pixel array. The first side is substantially perpendicular to the second side. The first and second line segments are electrically connected. The second repairing line includes third and fourth line segments respectively located on third and second sides of the pixel array. The third side is substantially parallel to the first side. The fourth and third line segments are electrically connected. The opposite substrate above the active device array substrate does not cover the first and third line segments.
Abstract:
A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.
Abstract:
An interconnect structure of an integrated circuit having improved reliability and a method for forming the same are provided. The method includes providing a substrate, forming a dielectric layer overlying the substrate, performing a first shrinking process, wherein the dielectric layer shrinks and has a first shrinkage rate, forming a conductive feature in the dielectric layer after the step of performing the first shrinking process, and performing a second shrinking process after the step of forming the conductive feature, wherein the dielectric layer substantially shrinks and has a second shrinkage rate.
Abstract:
A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.