公开(公告)号：US20050225955A1

公开(公告)日：2005-10-13

申请号：US10821458

申请日：2004-04-09

Applicant: John Grebenkemper ,  Frank Mikalauskas ,  Srinivasan Venkataraman ,  Jonathan Buck

Inventor： John Grebenkemper ,  Frank Mikalauskas ,  Srinivasan Venkataraman ,  Jonathan Buck

IPC: G01S13/00 ,  H05K1/00 ,  H05K1/02 ,  H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0218 ,  H05K1/0298 ,  H05K2201/0723 ,  H05K2201/09309 ,  H05K2201/09327

Abstract: A printed circuit board includes a power plane and a ground reference plane that includes two opposite sides. The power plane is positioned proximate one side of the ground reference plane. A signal layer is positioned proximate the other side of the ground reference plane to isolate the power plane from the signal layer. Any noise on the power plane or the signal layer is thus isolated by the intervening ground plane.

Abstract translation: 印刷电路板包括电源平面和包括两个相对侧的接地参考平面。 电源平面位于接地参考平面的一侧。 信号层位于接地参考平面的另一侧附近，以将功率平面与信号层隔离。 电力平面或信号层上的任何噪声因此被插入的接地层隔离。

公开(公告)号：US06873219B2

公开(公告)日：2005-03-29

申请号：US10352753

申请日：2003-01-28

Applicant: John Grebenkemper

Inventor： John Grebenkemper

IPC: H05K1/02 ,  H05K1/16 ,  H04B3/28 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/167 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0723

Abstract: A method and related configuration for attenuating high-frequency noise that may appear on power planes in printed circuit boards. In one embodiment, the noise attenuation means of the present invention involves applying a lower conductivity material between the conductive and dielectric layers within a printed circuit board. High-frequency noise is then attenuated by the skin effect. In another embodiment, the low conductivity material is applied between the power plane and dielectric layer within the printed circuit board. The low conductivity material may be a material, such as nickel or lead, having an electrical conductivity ranging between about 1×104 mhos/m and 5.8×107 mhos/m for layers having a thickness of about 2 mils.

Abstract translation: 一种用于衰减印刷电路板电源平面上可能出现的高频噪声的方法和相关配置。 在一个实施例中，本发明的噪声衰减装置包括在印刷电路板内的导电层和介电层之间施加较低导电性的材料。 然后，高频噪声被皮肤效应衰减。 在另一个实施例中，低电导率材料被施加在印刷电路板内的电源平面和电介质层之间。 对于具有约2密耳厚度的层，低导电性材料可以是诸如镍或铅的材料，对于具有约2密耳厚度的层，其电导率范围在约1×10 4 mhos / m至5.8×10 7 mhos / m之间。

公开(公告)号：US06870436B2

公开(公告)日：2005-03-22

申请号：US10097215

申请日：2002-03-11

Applicant: John Grebenkemper

Inventor： John Grebenkemper

IPC: G06F17/50 ,  H05K1/02 ,  H05K3/00 ,  H05K9/00 ,  H04B3/28

CPC classification number: H05K1/0234 ,  G06F17/5036 ,  H05K1/0231 ,  H05K3/0005 ,  H05K9/0039 ,  H05K2201/09309

Abstract: In a method of the present invention, performance characteristics of a printed circuit board are analyzed. The printed circuit board, bypass components and an applied stimulus are modeled. Each of the bypass components includes a capacitor and a resistor in series with each other. Alternatively, a second capacitor is coupled in parallel to the above capacitor and resistor. A simulation of the circuit model is then performed. In this embodiment of the invention, the simulation is responsive to the stimulus as is performed over a range of bypass resistor values. In another embodiment of the invention, a printed circuit board is described with components and characteristics that reduce noise. Such a printed circuit board includes a power plane and a plurality of bypass components. Moreover, the plurality of bypass components include bypass capacitors and bypass resistors coupled in series between the positive power plane and the negative power plane.

Abstract translation: 在本发明的方法中，分析印刷电路板的性能特征。 印刷电路板，旁路部件和应用的刺激被建模。 每个旁通部件包括彼此串联的电容器和电阻器。 或者，第二电容器并联到上述电容器和电阻器。 然后进行电路模型的模拟。 在本发明的该实施例中，模拟响应于在一定范围的旁路电阻值上执行的激励。 在本发明的另一个实施例中，描述了一种降低噪声的部件和特性的印刷电路板。 这种印刷电路板包括电源平面和多个旁路部件。 此外，多个旁路部件包括串联耦合在正电源平面和负电源平面之间的旁路电容器和旁路电阻器。