公开(公告)号：US20120038060A1

公开(公告)日：2012-02-16

申请号：US12855765

申请日：2010-08-13

Applicant: Jui-Hung CHENG

Inventor： Jui-Hung CHENG

IPC: H01L23/12 ,  H01L21/50

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27416 ,  H01L2224/2783 ,  H01L2224/27831 ,  H01L2224/29015 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/32055 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00

Abstract: A stacking carrier and a stacking method are provided. The stacking method is used between a wafer and a stacking carrier having the same shape. The stacking method includes the following steps. Firstly, an adhesive layer is coated on a surface of the carrier. Then, the adhesive layer corresponding to an edge of the carrier is partially removed, thereby defining at least one adhesive layer indentation. Afterwards, the wafer is stacked on the carrier through the adhesive layer having the adhesive layer indentation.

Abstract translation: 提供堆叠载体和堆垛方法。 在具有相同形状的晶片和堆叠载体之间使用层叠方法。 堆叠方法包括以下步骤。 首先，在载体的表面上涂布粘合剂层。 然后，对应于载体边缘的粘合剂层被部分地去除，从而限定至少一个粘合剂层压痕。 之后，通过具有粘合剂层压痕的粘合剂层将晶片堆叠在载体上。

公开(公告)号：US20120009394A1

公开(公告)日：2012-01-12

申请号：US12831404

申请日：2010-07-07

Applicant: Jui-Hung CHENG

Inventor： Jui-Hung CHENG

IPC: B32B3/10 ,  B32B3/02 ,  B05D5/06 ,  B32B37/02 ,  B44C1/22

CPC classification number: B32B37/1292 ,  B32B2310/0806 ,  B32B2457/14 ,  C09J5/00 ,  C09J2201/28 ,  C09J2203/326 ,  H01L27/14618 ,  H01L27/14632 ,  H01L2924/0002 ,  Y10T428/24793 ,  Y10T428/24802 ,  H01L2924/00

Abstract: A bonding method and a bonding substrate are provided. The bonding substrate is applied to a silicon wafer having the same shape. The bonding method includes the following steps. Firstly, the optical glass substrate is processed to form a first alignment mark. Then, an adhesive layer is coated on a surface of the optical glass substrate. The adhesive layer on the surface of the optical glass substrate is partially removed, thereby defining an adhesive structure. According to the first alignment mark of the optical glass substrate and a second first alignment mark of the silicon wafer, alignment between the optical glass substrate and the silicon wafer is performed. Afterwards, the optical glass substrate and the silicon wafer are bonded together through the adhesive structure.

Abstract translation: 提供接合方法和接合基板。 将接合基板施加到具有相同形状的硅晶片。 接合方法包括以下步骤。 首先，对光学玻璃基板进行处理，形成第一对准标记。 然后，在光学玻璃基板的表面上涂布粘合剂层。 部分去除光学玻璃基板表面上的粘合层，从而限定粘合剂结构。 根据光学玻璃基板的第一对准标记和硅晶片的第二第一对准标记，进行光学玻璃基板与硅晶片的对准。 之后，光学玻璃基板和硅晶片通过粘合剂结构结合在一起。